Infineon introduces the XDM700-1, a 12-bit digital current monitor IC enabling high-precision sensing and reporting

テクノロジーニュース

2026/03/17

Munich, Germany – 17 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its XDP™ protection and monitoring portfolio with the XDM700-1, a system monitoring and reporting IC for high-side or low-side current and voltage sensing with a wide input voltage range of up to 80 V. Utilizing XDP7xx protection as a platform, the XDM700-1 provides precise, real-time measurements, as well as monitoring and reporting capabilities, making it an essential component for a wide range of applications such as AI servers. 
 
Key features of the XDM700-1 include 12-bit voltage and current ADCs providing high-precision measurement accuracy of up to 0.4 percent for voltage, 0.75 percent for current, 1.15 percent for power, and 2.7 percent for energy, with a four-level programmable current-sense differential range of 12.5 mV, 25 mV, 50 mV, and 100 mV. Reporting is available in both the analog domain via the IMON pin and the digital domain via a PMBus® 1.3 interface operating at 1 MHz. Additional features include reporting telemetry of peaks and valleys as well as programmable warnings for overcurrent, input undervoltage, input overvoltage, output undervoltage, output overvoltage, input overpower, and overtemperature. To simplify system design and reduce BOM and footprint, the XDM700-1 integrates a 5 V regulator with 10 mA output capability and is offered in an industry-standard VQFN-24 pin package measuring 4 x 4 mm² with -40°C to +125°C junction temperature.
 
The XDM700-1 uses Infineon’s XDP7xx protection IPs and infrastructure to enable high-precision system monitoring and reporting, meeting the requirements of system designers. It combines a wide range of monitoring functions with a small footprint, making it ideal for various applications where precise voltage and current measurement, power and energy calculation, and high-performance reporting in analog and digital domains are critical. Target applications include (AI) server, telecommunications equipment, power management, power supplies, robotics, test equipment, and renewables. 
 
The XDP protection and monitoring ICs are optimized for use with Infineon’s broad AI server power delivery portfolio from grid to core – spanning solid-state transformers and circuit breakers, high-voltage and intermediate bus conversion, as well as second-stage DC conversion power modules. Leveraging the benefits of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) to achieve the highest efficiency, density, and robustness, Infineon gives customers a clear path to end-to-end power architectures with proven high-quality components, consistent design support, and scalable performance for next-generation AI server platforms.
 
Availability
Samples of the XDM700-1 are available now, while production is starting in April 2026. More product information is available here. 
 
APEC 2026
Don’t miss Infineon at APEC 2026, located at the Henry B. Gonzalez Convention Center in San Antonio, Texas, from March 22-26, 2026. Visit Infineon’s booth #1619 to see one of the industry’s broadest power device portfolios covering all relevant power technologies in silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). To book a media interview, please contact media.relations@infineon.com. 
 
Infineon AI Day Taiwan
The Infineon We Power AI Day is an industry event for business and technology leaders in Taiwan. Together with our ecosystem partners and customers, we explore the latest advances in the field of power technologies. The goal is a sustainable AI infrastructure enabled by Infineon’s innovative solutions – from grid to core. The event will take place in Taipei on March 31.

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

 

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The Infineon XDM700-1 is a system monitoring and reporting IC for high-side or low-side current and voltage sensing with a wide input voltage range of up to 80 V.

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Information Number : infpss202603-071

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Michael Burner

Spokesperson Consumer, Compute and Communication, PSS Division

+49 89 234 39300

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