CYW955513EVK-01

Bluetooth Embedded Audio Evaluation Kit (CYW955513EVK-01) for AIROC™ CYW55513/2/1 1x1 Wi-Fi 6E and Bluetooth® 5.4/Bluetooth® Low-Energy Audio Combo IC

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CYW955513EVK-01
CYW955513EVK-01

製品詳細

  • ファミリー
    Wi-Fi 6/6E (802.11ax)
  • ボードタイプ
    Evaluation Board
  • 対象アプリケーション
    General IoT
  • 接続性
    Wi-Fi/Bluetooth
  • 説明
    Bluetooth Embedded Audio Evaluation Kit (CYW955513EVK-01) for AIROC™ CYW55513/2/1 1x1 Wi-Fi 6E and Bluetooth® 5.4/Bluetooth Low-Energy Audio Combo IC
OPN
製哝ステータス
インフィニオンパッケージ
パッケージ坝
包装サイズ
包装形態
水分レベル
モイスポャーパッキン
鉛フリー
ポロゲンフリー
RoHS準拠
Infineon stock last updated:
The Infineon Embedded Audio Evaluation Kit (CYW955513EVK-01) enables the evaluation, prototyping, and development of embedded audio on the Arm® Cortex® -M33 of the AIROC™ CYW55513/2/1 Wi-Fi and Bluetooth® and Low Energy (LE) Audio Combo IC.

機能

  • 192 MHz Arm® Cortex®-M33
  • Embedded Bluetooth/BLE Audio support
  • Supports Bluetooth stack and profiles
  • Supports LC3 Codec
  • Bluetooth® Low Energy 5.4 features
  • LE Long Range, LE 2Mbps, Adv. Ext.
  • +13/+19 Bluetooth Power Amplifiers
  • -111.5dBm LE Long-Range Sensitivity
  • 2x TDM (I2S/PCM) Audio Interface
  • Up to 8-channels of audio
  • 8k to 96k sample rates
  • 16-, 24- and 32-bit sample widths

利点

  • Embedded operation offloads host
  • Frees up host processor resources
  • Supports Bluetooth and BLE Audio
  • Low-power operation extends battery life
  • 19dBm transmit power extends range
  • Best in class sensitivity extends range
  • Flexible audio interface

用途

ドキュメント

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