TSL111C FHZ0M512B3Q
Active and preferred
RoHS対応

TSL111C FHZ0M512B3Q

AIROC™ UWB for Consumer — Low power consumption: provable security and cost optimized sensing.
製品概要
パッケージ

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TSL111C FHZ0M512B3Q
TSL111C FHZ0M512B3Q
製品概要

製品仕様情報

  • NVM (不揮発性メモリ)
    512 kByte
  • PHY Layer
    IEEE 802.15.4z HRP
  • RAM
    64 kByte
  • Sensing
    No
  • Tx and Rx
    1Tx and 1Rx
  • パッケージ
    VQFN-40 with wettable flank
  • 標準
    FiRa
  • 温度 範囲
    -25 °C～85 °C
推奨
OPN
製品ステータス
インフィニオン パッケージ
パッケージ名
梱包サイズ
梱包形態
MSL (湿度感受性レベル)
防湿梱包
鉛フリー
ハロゲンフリー
RoHS対応
Infineon stock last updated:
AIROC™ TSL111C FHZ0M512B3Q delivers fine-ranging performance for applications ranging from simple two-way ranging to indoor navigation and asset tracking. Its cost-optimized RF architecture enables advanced sensing for use cases such as presence/occupancy detection to conserve energy in smart homes and buildings, gesture recognition for convenient human–machine interaction, and collision/obstacle avoidance in robotics. For details on sensing-enabled configurations and the AIROC™ Low Power Mode, please contact our sales team.

特長

  • Very low power consumption
  • High receiver sensitivity
  • Provable security
  • High First Path Dynamic Range (FPDR) for Non Line of Sight (NLoS) scenario
  • Channel 8, 9, 10 and 12
  • Radar Sensing mode

利点

  • Extended tag battery lifetime due to low power usage
  • Very accurate distance measurements, extended usage area & minimum multipath effect due to higher receiver sensitivity and high FPDR
  • Highest FiRa/CCC security levels (32- and 48 bit) even in challenging NLOS conditions (e.g., back pocket scenarios)
  • Future proof design with front-end designed for Channel 12
  • Cost and power optimized RF architecture for macro gesture, occupancy and breathing rate detection

アプリケーション

図

AIROC™ UWB Block diagram
AIROC™ UWB Block diagram
AIROC™ UWB Block diagram AIROC™ UWB Block diagram AIROC™ UWB Block diagram
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