EconoDUAL™ 3

概要

Leading IGBT technology for medium power applications

With the EconoDUAL™ 3 family, Infineon supports the complete current ranges from 100 A up to 600 A at 600 V / 650 V / 1200 V and 1700 V. Excellent mechanical robustness, power cycling capability, the option of PressFIT pins as well as the availability of TIM makes it a reliable, cost effective solution for applications in drives, CAV, wind turbines, solar, and hybrid vehicles. EconoDUAL™ 3 modules are available in 3-level, half-bridge, H-bridge and chopper topologies for efficient inverter designs.

製品

ハイライト

EconoDUAL™ 3 with Shunts

Reduced system costs by higher integration

EconoDUAL™ 3 modules are also available with integrated shunt resistors for current monitoring in the AC path. The integration of additional functionality into the IGBT module is a very effective way to optimize the overall system costs of an inverter.

External current sensors are no longer needed. This saves space in the system, reduces material costs and lowers manufacturing efforts.

Key Features	Main Application
1200 V state of the art IGBT4 technology Integrated shunts resistors for direct current measurement High current measurement accuracy across a wide temperature range Optimized heat spread guarantees effective thermal management PressFIT control pins and screw power terminals TIM – pre-applied thermal interface material to achieve longest lifetime Compact and robust design with molded terminals	CAV Drives UPS Solar

Key Features

Main Application

1200 V state of the art IGBT4 technology
Integrated shunts resistors for direct current measurement
High current measurement accuracy across a wide temperature range
Optimized heat spread guarantees effective thermal management
PressFIT control pins and screw power terminals
TIM – pre-applied thermal interface material to achieve longest lifetime
Compact and robust design with molded terminals

詳細

Related information about other products in this family

EconoDUAL™ 3 modules are equipped with the state-of-the-art IGBT4 technology supporting junction temperatures of T_vjop = 150°C for highest power density and leading-edge power cycling capability. The symmetrical design of the module enables optimized currency sharing between the IGBT half bridges in parallel operation.

Key Features	Main Application
PressFIT control pins for reduced mounting efforts and increased interconnection reliability TIM – pre-applied thermal interface material to achieve longest lifetime NTC integration for temperature control Fast design-in with Evaluation Boards Compact 3-level, half-bridge, H-bridge and chopper configurations with only 17 mm height Parallel operation enabled by symmetrical design T_vjop 150°C	CAV Drives Solar Wind UPS

Key Features

Main Application

PressFIT control pins for reduced mounting efforts and increased interconnection reliability
TIM – pre-applied thermal interface material to achieve longest lifetime
NTC integration for temperature control
Fast design-in with Evaluation Boards
Compact 3-level, half-bridge, H-bridge and chopper configurations with only 17 mm height
Parallel operation enabled by symmetrical design
T_vjop 150°C

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