Industrial 750 V EDT2 discretes

Discover our groundbreaking EDT2 industrial discrete technology

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概要

商用車、建設車両、農業用車両 (CAV) アプリケーションの高い要求を満たすように特別に調整された、パワー半導体用の画期的なEDT2 (Electric Drive Train) 産業用ディスクリート技術を紹介します。当社の革新的なソリューションは、既存のTO-247PLUSパッケージのアップグレードであるTO-247PLUS SMDパッケージを特長としており、245°Cでのリフローはんだ付けを最大3回までパッケージ裏面互換性を実現します。

主な特長

  • 用途に特化して最適化
  • TO-247PLUS SMDパッケージ
  • はんだ面の互換性を実現
  • 独自の剥離のない設計
  • 高電力密度
  • 優れた熱管理
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The unique, delamination-free design delivers exceptional high power density and superior thermal management. Our TO-247PLUS SMD package offers unparalleled performance in the most challenging conditions, paving the way for reliable, efficient, and cost-effective power semiconductor solutions. Experience the advantages of our cutting-edge EDT2 technology and the innovative TO-247PLUS SMD package. Our 750 V EDT2 TO-247PLUS SMD package marks a groundbreaking innovation in high-current density surface-mounted solutions. This first-of-its-kind, delamination-free package features a TO-247 footprint and houses a 200 A 750 V IGBT co-packed with a 200 A 750 V diode in a 3-pin configuration. The IGBT and diode are also available in 120 A-200 A, making the product ideal for CAV, trucks, and buses, and motor drive applications.

The key advantages of the 750 V EDT2 TO-247PLUS SMD package stem from its reflow soldering resistance and non-delaminating design. The tin plating, as opposed to nickel coating, combined with the package body's backside, allows the product to be utilized in resistance welding and reflow brazing at a temperature of 245°C. Thanks to its robust construction, the IKQB120N75CP2, IKQB160N75CP2, and IKQB200N75CP2 can be reflow soldered up to three times while ensuring delamination-free performance. These benefits optimize the product for SMD assembly, leading to lower system costs and improved EMC performance.

Discover the unparalleled accomplishment, reliability, and efficiency of our 750 V EDT2 DuoPack (IGBT+diode) TO-247PLUS SMD, specifically tailored for CAV applications and the rapidly evolving electric vehicle market. Upgrade your power semiconductor solutions with our revolutionary EDT2 technology and experience the inimitable performance and efficiency that come with state-of-the-art thermal management and high power density design.

The unique, delamination-free design delivers exceptional high power density and superior thermal management. Our TO-247PLUS SMD package offers unparalleled performance in the most challenging conditions, paving the way for reliable, efficient, and cost-effective power semiconductor solutions. Experience the advantages of our cutting-edge EDT2 technology and the innovative TO-247PLUS SMD package. Our 750 V EDT2 TO-247PLUS SMD package marks a groundbreaking innovation in high-current density surface-mounted solutions. This first-of-its-kind, delamination-free package features a TO-247 footprint and houses a 200 A 750 V IGBT co-packed with a 200 A 750 V diode in a 3-pin configuration. The IGBT and diode are also available in 120 A-200 A, making the product ideal for CAV, trucks, and buses, and motor drive applications.

The key advantages of the 750 V EDT2 TO-247PLUS SMD package stem from its reflow soldering resistance and non-delaminating design. The tin plating, as opposed to nickel coating, combined with the package body's backside, allows the product to be utilized in resistance welding and reflow brazing at a temperature of 245°C. Thanks to its robust construction, the IKQB120N75CP2, IKQB160N75CP2, and IKQB200N75CP2 can be reflow soldered up to three times while ensuring delamination-free performance. These benefits optimize the product for SMD assembly, leading to lower system costs and improved EMC performance.

Discover the unparalleled accomplishment, reliability, and efficiency of our 750 V EDT2 DuoPack (IGBT+diode) TO-247PLUS SMD, specifically tailored for CAV applications and the rapidly evolving electric vehicle market. Upgrade your power semiconductor solutions with our revolutionary EDT2 technology and experience the inimitable performance and efficiency that come with state-of-the-art thermal management and high power density design.

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