S-COM10.8
Active and preferred
RoHS対応

S-COM10.8

Dual-interface module with inductive coupling for highly demanding applications

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S-COM10.8
S-COM10.8

製品仕様情報

  • Derivatives
    Au surface, Pd surface
  • ISO - リファレンス
    ISO 7816-1, ISO 10373-1/-3, ISO 7810, ISO 14443
  • アプリケーション
    authentication, government identification
  • ピッチ
    14.25 mm
  • リーディング テクノロジー
    Coil on module
  • 厚さ
    max. 420 µm
  • 寸法
    13 x 11.8 mm
  • 接触面
    NiAu
  • 納品形態
    Tape on Reel
  • 製品の説明
    dual-interface module with inductive coupling for highly demanding applications
  • 製品名
    S-COM10.8
推奨
OPN
製品ステータス
インフィニオン パッケージ
パッケージ名
梱包サイズ
梱包形態
MSL (湿度感受性レベル)
防湿梱包
鉛フリー
ハロゲンフリー
RoHS対応
Infineon stock last updated:
The innovative ’Coil on Module’ package technology from Infineon uses a radiofrequency link rather than the common mechanical-electrical connection between the card antenna and the module, it employs two antennas, one on the module and one in the card, communicating w/o physical electrical connection.It improves the robustness of dual interface cards and simplifies card design and manufacturing, making it more efficient and faster.’Coil on Module’ underlines our technology leadership and is based on our extensive semiconductor and module expertise as well as profound understanding of card manufacturer’s

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