S-COM10.8

Dual-interface module with inductive coupling for highly demanding applications

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S-COM10.8
S-COM10.8

Product details

  • Applications
    authentication, government identification
  • Contact Surface
    NiAu
  • Delivery Forms
    Tape on Reel
  • Derivatives
    Au surface, Pd surface
  • Dimensions
    13 x 11.8 mm
  • ISO – Reference
    ISO 7816-1, ISO 10373-1/-3, ISO 7810, ISO 14443
  • Leading Technologies
    Coil on module
  • Pitch
    14.25 mm
  • Product Description
    dual-interface module with inductive coupling for highly demanding applications
  • Product Name
    S-COM10.8
  • Thickness
    max. 420 µm
OPN
Product Status
Infineon Package
Package Name
Packing Size
Packing Type
Moisture Level
Moisture Packing
Lead-free
Halogen Free
RoHS Compliant
Infineon stock last updated:
The innovative ’Coil on Module’ package technology from Infineon uses a radiofrequency link rather than the common mechanical-electrical connection between the card antenna and the module, it employs two antennas, one on the module and one in the card, communicating w/o physical electrical connection.It improves the robustness of dual interface cards and simplifies card design and manufacturing, making it more efficient and faster.’Coil on Module’ underlines our technology leadership and is based on our extensive semiconductor and module expertise as well as profound understanding of card manufacturer’s

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