IPL65R650C6S

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IPL65R650C6S
IPL65R650C6S

製品仕様情報

  • ID (最大)
    6.7 A
  • ID (@25°C) (最大)
    6.7 A
  • IDpuls (最大)
    16.6 A
  • Ptot (最大)
    56.8 W
  • QG (typ @10V)
    21 nC
  • QG
    21 nC
  • RDS (on) (最大)
    650 mΩ
  • RDS (on) (@10V) (最大)
    650 mΩ
  • RthJA (最大)
    62 K/W
  • RthJC (最大)
    2.2 K/W
  • Rth
    2.2 K/W
  • VDS (最大)
    650 V
  • VGS(th) 範囲
    2.5 V~3.5 V
  • パッケージ
    Thin-PAK 5x6
  • ピン数
    5 Pins
  • 予算価格€/ 1k
    0.62
  • 動作温度 (最小)
    -4 °C
  • 実装
    SMT
  • 極性
    N
OPN
製品ステータス
インフィニオン パッケージ
パッケージ名
梱包サイズ
梱包形態
MSL (湿度感受性レベル)
防湿梱包
鉛フリー
ハロゲンフリー
RoHS対応
Infineon stock last updated:
The new CoolMOS™ ThinPAK 5x6 is a leadless SMD package especially designed for high voltage MOSFETs. This new package has a very small footprint of 5x6mm 2 and a very low profile with only 1mm height. This significantly smaller package size in combination with its benchmark low parasitics inductances can be used as a new and effective way to decrease system solution size in power- density driven designs. The ThinPAK 5x6 package is characterized by a very low source inductance 1.6nH, as well as a similar thermal performance as DPAK. The package hence enables faster and thus more efficient switching of power MOSFETs and is easier to handle in terms of switching behavior and EMI.

特長

  • Small footprint (5x6mm²)
  • Low profile (1mm)
  • Low parasitic inductance
  • RoHS compliant
  • Halogen free mold compound

利点

  • Reduced board space consumption
  • Increased power density
  • Short commutation loop
  • Easy to use products
  • Environmentally friendly

アプリケーション

ドキュメント

デザイン リソース

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{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "コミュニティに質問する", "labelEn" : "コミュニティに質問する" }, { "link" : "https://community.infineon.com/", "label" : "すべてのディスカッションを表示", "labelEn" : "すべてのディスカッションを表示" } ] }