Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
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END OF LIFE
discontinued
RoHS Compliant

IPL65R650C6S

END OF LIFE
Data Sheet
package
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IPL65R650C6S
IPL65R650C6S
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Data Sheet

Product details

  • Budgetary Price €/1k
    0.62
  • ID (@25°C) max
    6.7 A
  • ID max
    6.7 A
  • IDpuls max
    16.6 A
  • Mounting
    SMT
  • Operating Temperature min
    -4 °C
  • Package
    Thin-PAK 5x6
  • Pin Count
    5 Pins
  • Polarity
    N
  • Ptot max
    56.8 W
  • QG (typ @10V)
    21 nC
  • QG
    21 nC
  • RDS (on) max
    650 mΩ
  • RDS (on) (@10V) max
    650 mΩ
  • RthJA max
    62 K/W
  • RthJC max
    2.2 K/W
  • Rth
    2.2 K/W
  • VDS max
    650 V
  • VGS(th)
    2.5 V to 3.5 V
OPN
IPL65R650C6SATMA1
Product Status discontinued
Infineon Package
PG-TSON-8
Package Name Thin-PAK 5x6
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
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Product Status discontinued
Infineon Package
PG-TSON-8
Package Name Thin-PAK 5x6
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The new CoolMOS™ ThinPAK 5x6 is a leadless SMD package especially designed for high voltage MOSFETs. This new package has a very small footprint of 5x6mm 2 and a very low profile with only 1mm height. This significantly smaller package size in combination with its benchmark low parasitics inductances can be used as a new and effective way to decrease system solution size in power- density driven designs. The ThinPAK 5x6 package is characterized by a very low source inductance 1.6nH, as well as a similar thermal performance as DPAK. The package hence enables faster and thus more efficient switching of power MOSFETs and is easier to handle in terms of switching behavior and EMI.

Features

  • Small footprint (5x6mm²)
  • Low profile (1mm)
  • Low parasitic inductance
  • RoHS compliant
  • Halogen free mold compound

Benefits

  • Reduced board space consumption
  • Increased power density
  • Short commutation loop
  • Easy to use products
  • Environmentally friendly

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }