SLC37ESA1M5

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SLC37ESA1M5
SLC37ESA1M5

Product details

  • CPU
    32-bit
  • NVM / 凌捷掩膜
    1.5 MByte
  • RAM
    48 kByte
  • Applications
    eSE, NFC embedded secure element - IC
  • Interfaces
    SWP, SPI, NRG™ (ISO/IEC 14443-3 type A with CRYPTO1), ISO 7816, GPIOs
  • Leading Technologies
    SOLID FLASH™, NFC optimized
  • Ambient Temperature
    -25 °C to 85 °C
  • Symmetric Cryptography
    DES, 3DES, AES up to 256-bit
  • Delivery Forms
    VQFN-32, WF WLB-25, wafer
  • Product Description
    security cryptocontroller optimized for embedded consumer applications (eSE, eSIM, converged devices)
  • Certifications
    CC EAL6+ high, EMVCo
  • Asymmetric Cryptography
    RSA up to 4096-bit, ECC up to 521-bit
OPN
製品ステータス
インフィニオンパッケージ
パッケージ名
包装サイズ
包装形態
水分レベル
モイスチャーパッキン
鉛フリー
ハロゲンフリー
RoHS準拠
Infineon stock last updated:
The SLC 37ESA product family provides you with a new class of performance and security. It is the perfect answer to today’s rising embedded security challenges. The SLC 37, combined with Infineon’s dedicated security and logistics services, will allow you to offer new services and applications to your customers, also helping you to reduce cost and to stay ahead of the competition.

機能

  • High-performance, 32-bit security crypto controller with 2 kByte cache featuring an enhanced 32-bit ARM® SecurCore® SC300™
  • Up to 2 MB SOLID FLASH™ NVM technology with proven flash loader technology, strong IP protection and EEPROM emulation support
  • Digital security concept – high-speed coprocessor for symmetrical cryptography (AES and DES) and for asymmetric cryptography (certified RSA and ECC library). Hybrid random number generator acc. to AIS 31 with physical noise source and built-in cryptographic post-processing
  • Family concept with the SLC37M series for reduced development effort
  • Multi-interface support with ISO 7816, SWP, SPI, I²C and GPIOs
  • CC EAL6+ (high) and EMVCo required for payment and eSIM applications
  • Various delivery form factors: wafer, WLCSP, SMD

利点

  • Lower design-in and integration effort
  • Reduced total cost of ownership and faster time-to-market based on optimized Infineon production chain
  • Differentiation through high performance
  • Reassurance of high-quality solutions backed by Infineon’s proven track record

用途

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{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "コミュニティに質問する", "labelEn" : "コミュニティに質問する" }, { "link" : "https://community.infineon.com/", "label" : "すべてのディスカッションを表示", "labelEn" : "すべてのディスカッションを表示" } ] }