PG-HDSOP-16-9

3Dモデルのダウンロード

パッケージの詳細

  • パッケージ材質
    PG
  • パッケージ ファミリー
    PG-HDSOP
  • 端子
    16
  • バリアント
    9
  • 露出したパドル
    有り
  • ボディ長 (mm)
    10.1
  • ボディ幅 (mm)
    9.9
  • 最小端子ピッチ (mm)
    1.2
  • TAPE & REEL
    Pieces/Box
    Tubes/Box
    リール径 (mm)
     
    1800
    1
    330
Infineon heat spreader dual small outline packages (HDSOP) are offered as different variants. Alternative designation examples are double discrete package (DDPAK) for HDSOP-10, quadruple discrete package (Q-DPAK) for HDSOP-22, quadruple discrete package in half-bridge configuration (Q-DPAK Dual) for HDSOP-16-221 or transistor outline leadless top-side cooling package (TOLT) for HDSOP-16-x. Versions with bottom-side cooling (BSC) and top-side cooling (TSC) are available depending on the product. The top-side heat-slug allows to decouple the thermal drain from the mounting board performance. The dual row gullwing shaped leads allow for high-throughput board mounting using surface mount technology (SMT). The lead construction causes a stand-off distance between the gullwing foot landing area and the exposed die pad plane which has to be considered during board mount design. Typical products are linear voltage regulators, controllers, power switches, full-bridge ICs, drivers, and more.

イメージギャラリー

PG-HDSOP-16-9_Footprint Drawing
PG-HDSOP-16-9_Footprint Drawing
PG-HDSOP-16-9_Footprint Drawing PG-HDSOP-16-9_Footprint Drawing PG-HDSOP-16-9_Footprint Drawing
PG-HDSOP-16-9_Package Outline PG-HDSOP-16-9_Package Outline PG-HDSOP-16-9_Package Outline
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ドキュメントと図面

ドキュメントと図面