Background for document preview
Background for thumbnail

Recommendation for Handling and Assembly of Infineon PG-SSO Sensor Packages

The purpose of this PG-SSO handling and board assembly document is the correct handling of the Sensor device during module assembly process at distributor/tier1 of our high volume leaded PG-SSO-X-xmagnetic Sensor packages/TLE types.

• 1.13 MB
• 13/04/2022