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PressFIT Technology, a Solderless Method for Mounting Power Modules

PressFIT is a force fitting technology for power semiconductor modules, providing a higher reliability to meet the trends to higher temperatures and new applications. Such technology is well known as a highly reliable connection for several years in the industry, in telecommunications and in automotive designs. For high current frequency-controlled inverters specific requirements need to be met. Therefore, we modify common reliability test procedures for power modules and PressFIT connections. The data was analyzed with special focus on the electrical resistance after climatic, vibration and temperature loads. In this editorial you will read more about the conclusion of our tests and find out why the reliability of the PressFIT technology is superior and also well-suited for power semiconductor modules.

• 376.72 KB
• 2006/01/24