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IPL65R1K0C6S
IPL65R1K0C6S

製品仕様情報

  • ID (@25°C) max
    4.2 A
  • ID max
    4.2 A
  • IDpuls max
    12.3 A
  • Ptot max
    34.7 W
  • QG (typ @10V)
    15 nC
  • QG
    15 nC
  • RDS (on) max
    1000 mΩ
  • RDS (on) (@10V) max
    1000 mΩ
  • RthJA max
    62 K/W
  • RthJC max
    3.6 K/W
  • Rth
    3.6 K/W
  • VDS max
    650 V
  • VGS(th)
    2.5 V to 3.5 V
  • パッケージ
    Thin-PAK 5x6
  • ピン数
    5 Pins
  • 予算価格€/ 1k
    0.49
  • 動作温度 min
    -40 °C
  • 実装
    SMT
  • 極性
    N
OPN
製品ステータス
インフィニオンパッケージ
パッケージ名
包装サイズ
包装形態
水分レベル
モイスチャーパッキン
鉛フリー
ハロゲンフリー
RoHS準拠
Infineon stock last updated:
The new CoolMOS™ ThinPAK 5x6 is a leadless SMD package especially designed for high voltage MOSFETs. This new package has a very small footprint of 5x6mm 2 and a very low profile with only 1mm height. This significantly smaller package size in combination with its benchmark low parasitics inductances can be used as a new and effective way to decrease system solution size in power- density driven designs. The ThinPAK 5x6 package is characterized by a very low source inductance 1.6nH, as well as a similar thermal performance as DPAK. The package hence enables faster and thus more efficient switching of power MOSFETs and is easier to handle in terms of switching behavior and EMI.

機能

  • Small footprint (5x6mm²)
  • Low profile (1mm)
  • Low parasitic inductance
  • RoHS compliant
  • Halogen free mold compound

利点

  • Reduced board space consumption
  • Increased power density
  • Short commutation loop
  • Easy to use products
  • Environmentally friendly

用途

ドキュメント

デザイン リソース

開発者コミュニティ

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "コミュニティに質問する", "labelEn" : "コミュニティに質問する" }, { "link" : "https://community.infineon.com/", "label" : "すべてのディスカッションを表示", "labelEn" : "すべてのディスカッションを表示" } ] }