FS770R08A6P2LB | 750 V 770 A 6パック自動車認定 IGBTモジュール

概要

The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The product FS770R08A6P2LB comes with a baseplate with bonded cooling structure.

特長

Blocking voltage 750V
Low V_CEsat
Low Switching Losses
Low Qg and Cres
Low Inductive Design
T_{vj op} = 150°C
Short-time extended Operation Temperature T_{vj op} = 175°C

利点

Compact Design
Direct Cooled Base Plate
Integrated NTC temperature sensor
PressFIT Contact Technology
RoHS compliant
Mechanical guiding elements
Long tabs for current sense

推奨アプリケーション例

Automotive Applications
Hybrid Electrical Vehicles (H)EV
Motor Drives
Commercial Agriculture Vehicles

パラメータ

技術資料他

注文

デザインサポート

ビデオ

Share

パートナー

トレーニング

Quality beyond the standard: Producing quality automotive power modules

Understand Infineon’s purpose in delivering quality above and beyond the standard and find out how we execute that standard in development, qualification, manufacturing and testing
Learn where and how this high-quality standard is reflected and discover our success stories

Watch eLearning

Infineon's 2nd generation HybridPACK™ Drive CoolSiC™

Infineon's HybridPACK™ Drive silicon carbide compact power modules cater to the increasing demand for high range, efficiency, and power in electrified vehicles, enabling longer drive range, compact size, and optimized system cost.

The second generation of Infineon's HybridPACK™ Drive, utilizing CoolSiC™ technology, offers a scalable product family with enhanced features and package improvements, providing added value to customers.