トラックおよび農機向けパワートレインインバータ

The reliability of power semiconductors used in CAV applications must meet the most stringent requirements. At the same time, PrimePACK™ enables cost-effective solutions in inverter designs with high power density. The robust design of PrimePACK™ modules and their high thermal load capacity and power cycling capability make them particularly suitable for heavy-duty vehicles with very demanding load profiles.

The EconoDUAL™ 3 equipped with TRENCHSTOP™ IGBT7 technology enables highest power density and leading-edge power cycling capability. The symmetrical design of the modules enables optimized current sharing between the IGBT half bridges in parallel operation. The modules are available in various topologies, and with integrated additional functionality, such as shunt resistors, for efficient inverter designs.

Infineon CoolSiC™ MOSFETs are built on a state-of-the-art trench semiconductor process optimized to allow for both the lowest losses in the application and the highest reliability in operation. The discrete CoolSiC™ MOSFET portfolio comes in 650 V, 1200 V, 1700 V, 2000V voltages classes, with on-resistance ratings from 7mohm up to 1000 mΩ.

The 7th generation of discrete IGBT technology has been released based on latest micro-pattern trenches technology which provide strongly reduced losses and offer a high level of controllability. The devices are offered in two different maximum reverse voltages Vce - 650 V and 1200 V - and are specifically optimized for all industrial applications that require lower losses, higher power density and smoother switching.