PrimePACK™ IGBT モジュール
要求に応えるパワー
NTC内蔵のPrimePACK™ IGBTハーフブリッジチョッパモジュールは、最新コンバータへ組み込みに最適化されています。
重要な利点に、高い信頼性、高い製品寿命への要求、優れた熱特性、低い浮遊インダクタンス、広い動作温度範囲、高絶縁の内蔵NTC、インフィニオンの1200 V、1700 V TRENCHSTOPTMテクノロジーなどがあります。
PrimePACK™ with IGBT4
The standard PrimePACK™ modules with IGBT4 come in halfbridge or chopper configuration. The PrimePACK™ 2 and 3 packages offer high power density and thus enable compact inverter sizes.
This family of IGBT modules is available in 1200 and 1700 V TRENCHSTOP™ technology. It comes with an integrated NTC with high isolation.
PrimePACK™ with IGBT5 and .XT
Wind power applications require a high reliability and robustness, combined with system availability and long lifetime.
PrimePACK™ modules with IGBT5 and .XT meet those requirements: IGBT5 allows higher power density, whereas the .XT interconnection technology extends the lifetime by increased thermal and power cycling capabilities.
The IGBT5 chip generation allows for an increase in output current by around 30%, which made some changes to the PrimePACK™ housing necessary.
Download the whitepaper to read about the new housing investigation and an inverter under real application conditions
.XT interconnection technology addresses all reliability relevant levels within the power module package in order to realize long lifetimes under thermo-mechanical stress. In this whitepaper, the correlation of thermal cycling test data was correlated with the responsible failure mechanisms was explored.
PrimePACK™ with TIM as an option for both IGBT4 & IGBT5
Both IGBT4 as well IGBT5 PrimePACK™ modules are available with pre-applied thermal interface material (TIM).
PrimePACK™ IGBT modules with TIM increase system reliability and optimize the thermal management e.g. an 8 K reduction in Tj is observed when using Infineon’s TIM without the pump-out threat and degradation of thermal stability.
In addition handling in mounting and maintenance can be improved. This reduces process time in manufacturing.
Thermal interface material (TIM) is a key component in the majority of power electronic systems. Heat, generated by the semiconductors, has to be transferred to a heat sink and finally to ambient.
In this paper, you will read about the needs and the steps described in developing a thermal interface material, especially dedicated for the use in power electronics.
今日、電化の波が輸送に革命をもたらしています。しかし、商用車、建機および農機用の車両は、パワーエレクトロニクスの課題に直面しています。 機器は、北極から砂漠にいたるまであらゆる場所で、長い動作寿命と最小限の停止時間で動作し、常に衝撃や振動にさらされます。電化はCAVに新たな機会をもたらします。インフィニオンはお客様のデザインに、将来に向けた専門的なソリューションをご提供します。
CAVソリューションに対するインフィニオンの洞察。本ビデオは、対象アプリケーションから、主な特長および利点まで、商用車、建機および農機用のインフィニオン製品をご紹介します。CAV向けの幅ひろいインフィニオン製品をご覧ください。
インフィニオンは、商用車、建機および農機(CAV)作成のベストパートナーです。本ビデオでは、CAV向けのインフィニオン製品の詳しい洞察、および技術的な解説をします。定評のある専門技術を使用した最適な設計、堅牢で高品質な制御・パワー半導体ソリューションの包括的な製品ラインアップをご紹介します。
- the history of wind energy and its future challenges
- a comparison between standard IGBTs and PrimePACK™ .XT IGBTs regarding their composition and production processes
- the solution for wind energy production in locations with low wind speeds
In this training you will get an overview of the PrimePACK™ portfolio and how it fulfils the requirements of heavy duty CAV applications.
Get to know the broad classification of the Wind turbines. Do you want to comprehend the most widely used wind power converter topologies, the major advantage and disadvantages as well as the key requirements of a wind power converter?
