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Board Assembly Recommendations (TO)

This document provides information about the board assembly of Infineon transistor outline (TO) and heatsink small outline gullwing (HSOG) packages by surface mount technology (SMT) and through-hole technology (THT). TO packages are available as surface-mount devices (SMD) and through-hole devices (THD). The I/O leads of the single-ended SMD packages are bent outwards from the package mold body side forming a distinct “foot” and “heel” geometry. That “gullwing” shaped lead geometry can be mounted on the same board surface together with the heat sink pad using fully automated processes. The leads of THD are inserted in drilled holes of the board prior to soldering. Depending on the specific process and technology, this may require certain pre-mount processing steps. The heat sink of THD package can either be mounted on the board or can be equipped with an additional heatspreader. The packages are optimized for silicon (Si) and silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET), insulated-gate bipolar transistor (IGBT), and Schottky diode devices for automotive and industrial power applications and provide a high heat dissipation. This document does not discuss dual small outline (DSO) or heatspreader dual small outline package (HDSOP) from so called transistor outline leaded top-side cooling (TOLT) package family. These package families are described in separate documents.

• 1.92 MB
• 2021/10/11