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Infineon named as the Company to Beat in AI Data Center Power Semiconductors by Gartner® as of May 18, 2026
Infineon named as the Company to Beat in AI Data Center Power Semiconductors by Gartner® as of May 18, 2026
Business & Financial Press
Munich, 26 June 2026 – In a recent report AI Vendor Race: Infineon Is the Company to Beat in AI Data Center Power Semiconductors, Gartner® examined the fast-evolving market for AI data center power semiconductors and identified Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) as "the company to beat" in this space. The report cites Infineon's 'comprehensive product portfolio, manufacturing capabilities and early investment in advanced technologies' as the decisive factors behind its company-to-beat status. According to Gartner, Infineon's front-runner position is being tested by growing competition in silicon carbide (SiC) and gallium nitride (GaN) and by rivals focused on the compute board level, dynamics that Infineon is actively addressing through its broad portfolio and system-level expertise.
As portfolio breadth and system-level expertise emerge as defining capabilities for AI data center operators seeking to scale sustainably, Infineon projects €2.5 billion in AI market revenue for its fiscal year 2027, underpinned by the leading portfolio position across the AI power delivery chain.
A broad portfolio spanning the entire power delivery chain
Gartner recognizes that Infineon secures its position in the AI data center semiconductor market through a comprehensive “grid-to-core” solution across the entire power delivery architecture, which strategically addresses the unprecedented power density and the thermal bottlenecks of high-performance AI workloads. While many competitors address only isolated stages of the data center power chain, Infineon delivers optimized semiconductor solutions at every conversion stage, from solid-state transformers (SST), power supply units (PSU) and energy storage systems (ESS) to intermediate bus conversion (IBC) and processor-level power management, ensuring that efficiency, reliability and performance are maximized across the entire system.
By optimizing every link in the power delivery chain with the right semiconductor technology at each stage, Infineon enables data center operators to reduce cumulative energy losses across multiple conversion stages, a critical advantage at hyperscale and a meaningful contribution to the industry's broader sustainability goals.
SiC and GaN: the right technology at every stage
Reinforcing Infineon's broad portfolio is its strategic combination of semiconductor materials. Gartner notes that Infineon’s strategic and early investments in wide-bandgap (WBG) semiconductors, including SiC and GaN, give it critical advantages in offering energy-efficient power solutions, particularly for next-generation 800 VDC AI data centers. By seamlessly integrating advanced WBG materials – specifically SiC for high-efficiency, high-voltage grid-to-rack conversions and GaN for ultradense, high-frequency intermediate power stages – alongside traditional silicon (Si) at the processor level, Infineon minimizes energy loss at every single conversion step.
From powering AI data centers to physical AI
Infineon continues to expand its partnerships across the AI value chain, working closely with system integrators, data center operators and technology leaders to accelerate the development of next-generation power architectures.
Beyond the data center, Infineon's advanced semiconductor solutions bring physical AI to life, enabling humanoid robots, collaborative machines and autonomous systems to perceive, think and act safely and securely. With expertise spanning microcontrollers, power systems, sensing, connectivity, functional safety and security, Infineon is a trusted partner across the full spectrum of physical AI platforms. With the global robotics market projected to reach up to $1.7 trillion by 2050 and 300 million humanoids operating worldwide (UBS Research, 2025), and an estimated average semiconductor bill of materials of $500 per humanoid robot, physical AI represents one of the most significant growth opportunities of the coming decades. From the utility grid to the processor core, and from the data center to the factory floor, Infineon powers the full arc of the AI era.
Gartner Report, AI Vendor Race: Infineon Is the Company to Beat in AI Data Center Power Semiconductors, By Menglin Cao, Rajeev Rajput, May 2026. Gartner is a trademark of Gartner, Inc. and/or its affiliates.
Gartner does not endorse any vendor, product or service depicted in its research publications and does not advise technology users to select only those vendors with the highest ratings or other designation. Gartner research publications consist of the opinions of Gartner’s research organization and should not be construed as statements of fact. Gartner disclaims all warranties, expressed or implied, with respect to this research, including any warranties of merchantability or fitness for a particular purpose.
Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).
Press Photos
Gartner identifies Infineon's role in enabling 800 VDC power architectures for AI data centers as a defining factor in its industry leader status.
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Information Number : infxx202606-117
Michael Burner
Spokesperson Consumer, Compute and Communication, PSS Division
+49 89 234 39300