eFuses

eFuses for automotive and industrial applications: solid-state and resettable system protection with integrated diagnostics

About

Automotive eFuses are integrated high-side switches or gate driver ICs with embedded I²t wire protection and with adjustable overcurrent limitation isolates system failures. In contrast to traditional melting fuses, eFuses provide a resettable, solid state protection for modern 12 V E/E architectures, enabling dependable zonal power distribution at reduced wire harness. Our product lineup spans from eFuses with integrated high side switches to gate drivers with external MOSFETs, thus covering currents from 5 A to 300 A at 12 V supply.  A low power idle mode minimizes the current consumption while providing power to maintain control. Its advanced diagnostic coverage along with an integrated SPI serial bus interface enables data exchange, e.g. for predictive maintenance. A capacitive load switching mode charges capacitive loads at reduced time. Configurable undervoltage lockout supports priority based load shedding to stabilize the electrical system during failure events.

Available options include PROFET™ and SPOC™ Wire Guard with or without SPI configurable protection and EiceDRIVER™ APD products. All products are developed according to ISO 26262 as safety elements.

Smart eFuses are intelligent, solid-state protection devices that replace bulky, slow-blowing mechanical fuses. They offer fully integrated inrush control and protection against overcurrent, voltage fluctuations & short-circuits while enabling diagnostics and control without dependency on an external controller. eFuses contribute to the systems' uninterrupted operations by enabling the replacement of faulty components without powering down the system.

XDP™ eFuses are designed for next-generation high-power 48 V systems & combine accurate current sensing, adjustable protection thresholds & advanced fault management in compact industry compatible packages, making them ideal for demanding applications such as AI servers, hyperscale data centers, humanoid robots, high-efficiency power supplies & industrial systems. 

With features like programmable protection, telemetry via PMBus®, analog current reporting (IMON) as well as robust SOA control, XDP™ eFuses help increase system reliability & robustness, simplify design & enable safer, more compact power architectures. XDP™ eFuses are qualified for industrial applications according to JEDEC47/20/22 & are IPC2221B & IPC9592B HV compliant. 

Infineon offers comprehensive design-in materials, including application notes, evaluation boards, PCB design data, simulation models, and online simulations available in the "Design Support" section of each product page. For our efuses, two specialized tool suites streamline your design process:

The Infineon Smart Power Tool Suite supports automotive power distribution with Smart Power Switches and Gate Driver ICs, guiding designers from concept to implementation. Our "Finder and Selection" tools identify optimal devices for specific load requirements, whereas our "Simulation & Modelling" tools evaluate power MOSFET circuits and distribution designs across scenarios. Document results and validate configurations using evaluation boards and "Configuration" tools.

"XDP™ Designer" is the configuration tool/GUI for Infineon's DC-DC controllers and Protection ICs which use a Graphical User Interface (GUI) for ease of configuring the device for specific applications.

Both tools share a common purpose: simplifying component selection, configuration, and validation for power management designs while reducing development time and effort.

With Infineon’s eFuse devices, designers are well prepared for the today's and upcoming challenges of the automotive electronic/electrical (E/E) architectures which demand components that meet the requirements for ISO 26262 classifications used in failsafe power distribution systems. Our devices are ISO-ready, providing a solid foundation for designing dependable electronics based on Functional Safety (FuSa) principles.

To get access to the ISO 26262 documentation, please register for myinfineon.com with your company e-mail address. Get in touch with your respective distribution or sales contact to request the elevation of your myInfineon account to partner status. This is required for access to our myICP portal for download.

Infineon ensures high-quality products by adhering to a dedicated qualification process that verifies functionality, reliability, and manufacturability. Besides wafer and package technology qualification, the product qualification proves form, fit, function, and reliability of the final products incl. design, chip, package, and their interaction. Furthermore, the operating environment as well as software and firmware is being taken into account.

Infineon's smart eFuses are qualified according to JEDEC47/20/22. For industrial and server power-path components, this qualification is used to show how the device can survive manufacturing handling and field stresses over life. More details can be found in the qualification report of each device or under below links. In addition, key industry standards IPC2221B and IPC9592B are used in PCB design to determine electrical spacing, i.e. clearance and creepage, between devices, aiming to prevent electrical breakdown. Through IPC9592B, specific guidelines for power conversion devices in computer and telecommunication industries are adhered.

Automotive eFuses are integrated high-side switches or gate driver ICs with embedded I²t wire protection and with adjustable overcurrent limitation isolates system failures. In contrast to traditional melting fuses, eFuses provide a resettable, solid state protection for modern 12 V E/E architectures, enabling dependable zonal power distribution at reduced wire harness. Our product lineup spans from eFuses with integrated high side switches to gate drivers with external MOSFETs, thus covering currents from 5 A to 300 A at 12 V supply.  A low power idle mode minimizes the current consumption while providing power to maintain control. Its advanced diagnostic coverage along with an integrated SPI serial bus interface enables data exchange, e.g. for predictive maintenance. A capacitive load switching mode charges capacitive loads at reduced time. Configurable undervoltage lockout supports priority based load shedding to stabilize the electrical system during failure events.

Available options include PROFET™ and SPOC™ Wire Guard with or without SPI configurable protection and EiceDRIVER™ APD products. All products are developed according to ISO 26262 as safety elements.

Smart eFuses are intelligent, solid-state protection devices that replace bulky, slow-blowing mechanical fuses. They offer fully integrated inrush control and protection against overcurrent, voltage fluctuations & short-circuits while enabling diagnostics and control without dependency on an external controller. eFuses contribute to the systems' uninterrupted operations by enabling the replacement of faulty components without powering down the system.

XDP™ eFuses are designed for next-generation high-power 48 V systems & combine accurate current sensing, adjustable protection thresholds & advanced fault management in compact industry compatible packages, making them ideal for demanding applications such as AI servers, hyperscale data centers, humanoid robots, high-efficiency power supplies & industrial systems. 

With features like programmable protection, telemetry via PMBus®, analog current reporting (IMON) as well as robust SOA control, XDP™ eFuses help increase system reliability & robustness, simplify design & enable safer, more compact power architectures. XDP™ eFuses are qualified for industrial applications according to JEDEC47/20/22 & are IPC2221B & IPC9592B HV compliant. 

Infineon offers comprehensive design-in materials, including application notes, evaluation boards, PCB design data, simulation models, and online simulations available in the "Design Support" section of each product page. For our efuses, two specialized tool suites streamline your design process:

The Infineon Smart Power Tool Suite supports automotive power distribution with Smart Power Switches and Gate Driver ICs, guiding designers from concept to implementation. Our "Finder and Selection" tools identify optimal devices for specific load requirements, whereas our "Simulation & Modelling" tools evaluate power MOSFET circuits and distribution designs across scenarios. Document results and validate configurations using evaluation boards and "Configuration" tools.

"XDP™ Designer" is the configuration tool/GUI for Infineon's DC-DC controllers and Protection ICs which use a Graphical User Interface (GUI) for ease of configuring the device for specific applications.

Both tools share a common purpose: simplifying component selection, configuration, and validation for power management designs while reducing development time and effort.

With Infineon’s eFuse devices, designers are well prepared for the today's and upcoming challenges of the automotive electronic/electrical (E/E) architectures which demand components that meet the requirements for ISO 26262 classifications used in failsafe power distribution systems. Our devices are ISO-ready, providing a solid foundation for designing dependable electronics based on Functional Safety (FuSa) principles.

To get access to the ISO 26262 documentation, please register for myinfineon.com with your company e-mail address. Get in touch with your respective distribution or sales contact to request the elevation of your myInfineon account to partner status. This is required for access to our myICP portal for download.

Infineon ensures high-quality products by adhering to a dedicated qualification process that verifies functionality, reliability, and manufacturability. Besides wafer and package technology qualification, the product qualification proves form, fit, function, and reliability of the final products incl. design, chip, package, and their interaction. Furthermore, the operating environment as well as software and firmware is being taken into account.

Infineon's smart eFuses are qualified according to JEDEC47/20/22. For industrial and server power-path components, this qualification is used to show how the device can survive manufacturing handling and field stresses over life. More details can be found in the qualification report of each device or under below links. In addition, key industry standards IPC2221B and IPC9592B are used in PCB design to determine electrical spacing, i.e. clearance and creepage, between devices, aiming to prevent electrical breakdown. Through IPC9592B, specific guidelines for power conversion devices in computer and telecommunication industries are adhered.

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