High Density IBC modules

High efficiency, high power density solutions to reduce TCO for AI data centers

Overview

Infineon-designed IBC modules integrate premium quality Infineon devices - including MOSFETs, GaN devices, controllers, and drivers - to implement proprietary architectures with optimized magnetics . This advanced integration results in high-quality, reliable modules that offer a compact, efficient intermediate bus for 48 V backplanes, leading to lower TCO, reduced EMI, and improved thermal margins compared to typical discrete designs.

Key Features

  • High power density modules
  • High efficiency and low losses
  • Realible Infineon switches
  • Meets Infineon quality standards
  • PMBus telemetry & control included
  • Protection: UVLO, OCP, OVP
  • Thermal-optimized design
  • Collateral for easy integration

About

48 V intermediate bus converters modules in data centers

Driven by AI workloads and their extreme power draw, data centers are adopting 48 V intermediate-bus architectures in which an intermediate bus converter (IBC) turns the 48 V busbar feeding accelerator cards into a lower-voltage rail (regulated or unregulated) that allows secondary stages to efficiently generate tight core and point-of-load rails. This multi-stage approach reduces distribution losses, provides headroom for fast, wide load transients that can reach about 2× average power, and meets stringent constraints on board area, thermal limits (PCBs can approach 80°C), and uptime, making IBC converters the preferred path to high density, high efficiency, and reliability.

Discover this webinar Check this training

Why IBC modules compared to downboard solutions

Compared with down-board discrete IBC designs, IBC power modules simplify design and layout, integrate control, magnetics, and protection in a proven thermally optimized package, ease EMI compliance, deliver higher power density and elevated peak power capability, accelerate time to market, and strengthen supply-chain resilience through standardized footprints and multi-source compatibility.

See interactive block diagram

Why choose Infineon for computing solutions

Infineon is a power semiconductor market leader in computing, leveraging silicon and wide-bandgap technologies and advanced BCD processes. We deliver cutting-edge solutions with advanced packaging, including multi-die embedding, power modules, and integrated magnetics, along with system-level expertise in novel 48 V and 12 V topologies, advanced magnetics, vertical power delivery, and scalable architectures. Our modules are rigorously qualified to Infineon’s stringent quality standards, ensuring proven reliability. We offer complete system knowledge and a wide portfolio of products.

48 V intermediate bus converters modules in data centers

Driven by AI workloads and their extreme power draw, data centers are adopting 48 V intermediate-bus architectures in which an intermediate bus converter (IBC) turns the 48 V busbar feeding accelerator cards into a lower-voltage rail (regulated or unregulated) that allows secondary stages to efficiently generate tight core and point-of-load rails. This multi-stage approach reduces distribution losses, provides headroom for fast, wide load transients that can reach about 2× average power, and meets stringent constraints on board area, thermal limits (PCBs can approach 80°C), and uptime, making IBC converters the preferred path to high density, high efficiency, and reliability.

Discover this webinar Check this training

Why IBC modules compared to downboard solutions

Compared with down-board discrete IBC designs, IBC power modules simplify design and layout, integrate control, magnetics, and protection in a proven thermally optimized package, ease EMI compliance, deliver higher power density and elevated peak power capability, accelerate time to market, and strengthen supply-chain resilience through standardized footprints and multi-source compatibility.

See interactive block diagram

Why choose Infineon for computing solutions

Infineon is a power semiconductor market leader in computing, leveraging silicon and wide-bandgap technologies and advanced BCD processes. We deliver cutting-edge solutions with advanced packaging, including multi-die embedding, power modules, and integrated magnetics, along with system-level expertise in novel 48 V and 12 V topologies, advanced magnetics, vertical power delivery, and scalable architectures. Our modules are rigorously qualified to Infineon’s stringent quality standards, ensuring proven reliability. We offer complete system knowledge and a wide portfolio of products.

Documents

Documents

Design resources

Developer community

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