Power MOSFET bare die products for industrial and consumer applications

OptiMOS™ and StrongIRFET™ low and medium voltage power MOSFET bare die

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Overview

Infineon's OptiMOS™ and StrongIRFET™ 25 V to 250 V power MOSFET bare die families address a broad range of needs from low to high switching frequency applications. Potential applications include motor control, synchronous rectification for AC-DC SMPS, isolated DC-DC converters and OR-ing switches and circuit breakers in 48 V systems.

Key Features

  • Very low on-resistance RDS(on)
  • Fast switching capabilities
  • Outstanding performance
  • Wide range of product offering

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About

Bare die product solution

OptiMOS™ bare die products combine very low on-state resistance (RDS(on)) and fastest switching behavior, providing outstanding performance to a wide range of industrial and consumer applications. StrongIRFET™ bare die is optimized for low RDS(on) and high current capability and are ideally suited for low frequency applications requiring performance and ruggedness.

Bare die features and benefits:

  • Suitable for die bond: soldered or glued
  • Backside metallization: NiAg system
  • Frontside metallization: AICu system
  • Passivation: imide (only on edge structure)
Additional information on die

If you are looking for guidance for setting up die assembly process, check out our application note "AN-1061 Bare Die: Die Attach and Wire Bonding". 

For more information regarding StrongIRFET™ and OptiMOS™ power MOSFET bare die products, please contact the Infineon Service Center or your local sales counterpart.

Infineon Service Center or local sales counterpart

Bare die product solution

OptiMOS™ bare die products combine very low on-state resistance (RDS(on)) and fastest switching behavior, providing outstanding performance to a wide range of industrial and consumer applications. StrongIRFET™ bare die is optimized for low RDS(on) and high current capability and are ideally suited for low frequency applications requiring performance and ruggedness.

Bare die features and benefits:

  • Suitable for die bond: soldered or glued
  • Backside metallization: NiAg system
  • Frontside metallization: AICu system
  • Passivation: imide (only on edge structure)

Additional information on die

If you are looking for guidance for setting up die assembly process, check out our application note "AN-1061 Bare Die: Die Attach and Wire Bonding". 

For more information regarding StrongIRFET™ and OptiMOS™ power MOSFET bare die products, please contact the Infineon Service Center or your local sales counterpart.

Infineon Service Center or local sales counterpart

Documents

Documents

Design resources

Developer community

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