Flash+RAM MCP solutions

Flash and RAM in a single package for ease of design

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Overview

For systems that require flash and RAM memory, Infineon multi-chip package (MCP) solutions simplify overall system design. By integrating both memories into a single package, Infineon MCP products decrease the BOM, lower the pin count, and reduce the PCB size and layer requirements. Infineon MCP solutions offer a single, space-saving package with no compromise in performance and quality.

Key Features

  • Flash and RAM in a single package
  • Standard pinouts
  • Common footprints
  • xSPI-compliant interfaces
  • Smaller, simpler PCB
  • Lower pin count
  • Fewer PCB layers
  • Easy migration
  • Fast time to market

Products

About

Next-generation portfolio of multi-chip package (MCP) memory products

Flash+RAM MCP Gen 2 improves on HYPERBUS™ MCP (the prior generation) with increased performance and reliability. MCP Gen 2 upgrades from HYPERFLASH™ to SEMPER™ NOR flash and from HYPERRAM™ 1.0 to HYPERRAM™ 2.0. MCP Gen 2 also expands chipset support with the addition of an octal interface option.

Enhance new and existing designs with compatible memory packages

Compared to separate flash and RAM chips, Infineon MCPs simplify PCB complexity in two ways:

  1. Combining two chips in one reduces the BOM.
  2. Going from a wide, parallel DDR SDRAM interface to a shared serial interface reduces the number of traces.

The result is a smaller PCB with fewer layers. Infineon also enables backward and forward compatibility with common packages. SEMPER™ NOR flash, HYPERFLASH™, HYPERRAM™, and MCP solutions all share a consistent footprint and pinout. This common design enables a single board to support a variety of memories without major redesign and provides the flexibility to easily expand from flash or RAM to a system that supports both.

Standard JEDEC xSPI interfaces (Octal and HYPERBUS™)

The JEDEC xSPI standard (JESD251) was adopted in 2017 to promote compatibility and interoperability between memory, chipsets, and other devices. Infineon’s Flash+RAM MCP Gen 2 is offered in Octal (JEDEC xSPI Profile 1) and HYPERBUS™ (JEDEC xSPI Profile 2) interface options. Both offer the maximum x8 performance of 400 MBps as specified by the standard.

Solutions Hub (SDKs, kits and boards, IDEs, OS support)

SEMPER™ Solutions Hub provides all the necessary building blocks to successfully integrate SEMPER™ NOR flash into your design, including:

  • Software development kits
  • Hardware development platforms
  • Support for a variety of development environments
  • Linux/U-Boot support

Visit the hub now to gain time-to-market advantage.

SEMPER™ Solutions Hub

Next-generation portfolio of multi-chip package (MCP) memory products

Flash+RAM MCP Gen 2 improves on HYPERBUS™ MCP (the prior generation) with increased performance and reliability. MCP Gen 2 upgrades from HYPERFLASH™ to SEMPER™ NOR flash and from HYPERRAM™ 1.0 to HYPERRAM™ 2.0. MCP Gen 2 also expands chipset support with the addition of an octal interface option.

Enhance new and existing designs with compatible memory packages

Compared to separate flash and RAM chips, Infineon MCPs simplify PCB complexity in two ways:

  1. Combining two chips in one reduces the BOM.
  2. Going from a wide, parallel DDR SDRAM interface to a shared serial interface reduces the number of traces.

The result is a smaller PCB with fewer layers. Infineon also enables backward and forward compatibility with common packages. SEMPER™ NOR flash, HYPERFLASH™, HYPERRAM™, and MCP solutions all share a consistent footprint and pinout. This common design enables a single board to support a variety of memories without major redesign and provides the flexibility to easily expand from flash or RAM to a system that supports both.

Standard JEDEC xSPI interfaces (Octal and HYPERBUS™)

The JEDEC xSPI standard (JESD251) was adopted in 2017 to promote compatibility and interoperability between memory, chipsets, and other devices. Infineon’s Flash+RAM MCP Gen 2 is offered in Octal (JEDEC xSPI Profile 1) and HYPERBUS™ (JEDEC xSPI Profile 2) interface options. Both offer the maximum x8 performance of 400 MBps as specified by the standard.

Solutions Hub (SDKs, kits and boards, IDEs, OS support)

SEMPER™ Solutions Hub provides all the necessary building blocks to successfully integrate SEMPER™ NOR flash into your design, including:

  • Software development kits
  • Hardware development platforms
  • Support for a variety of development environments
  • Linux/U-Boot support

Visit the hub now to gain time-to-market advantage.

SEMPER™ Solutions Hub

Documents

Documents

Design resources

Developer community

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