Network switches for AI data centers and server racks

Full LV DC-DC processor power solution for networking and switch platforms

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Overview

Discover Infineon's full power solutions for any network interface card (NIC) or networking and switch platforms. Experience our top-notch digital multiphase power solutions, ensuring unmatched efficiency, response time, and telemetry reporting. Our latest core power solutions, with TLVR technology, optimize power performance for high-current SoCs, reducing costs, and saving valuable PCB space.

Benefits

  • Supreme power conversion efficiency
  • Fastest transient response speed
  • Precise telemetry reporting
  • Reduced output capacitance
  • Lowered system costs
  • Saved valuable PCB space

About

High-efficiency LV DC-DC power is critical for delivering the high density and low latency required to optimize data center network switch performance under dynamic and high-bandwidth loads.

Infineon offers a comprehensive portfolio featuring:

  • XDP™ digital multiphase controllers: For precise and programmable power management 
  • OptiMOS™ integrated smart power stages: To maximize efficiency in compact footprint
  • High-density dual- or quad-phase power modules: Engineered for space-constrained environments

Infineon's solutions for core and other rails used in data center network architecture 

  • Superior power conversion efficiency: Reduces thermal load and operational costs
  • Ultra-fast transient response speed: Ensures voltage stability during rapid SoC load changes
  • Precise telemetry reporting: Enables real-time health monitoring and predictive maintenance

Furthermore, maximize the efficiency of your data center network architecture with core power solutions that leverage trans-inductor voltage regulation (TLVR) technology. This approach supports high-current SoC performance while significantly reducing output capacitance, lowering total BOM costs, and valuable PCB space.

TLVR is a high-speed power delivery topology that utilizes magnetically coupled inductors to provide the ultra-fast transient response and reduced capacitance required by high-current ASICs in modern data center switch architecture. 

Infineon implements this TLVR solution for high-performance systems by combining XDP™ digital power controllers with OptiMOS™ power stages.

How does TLVR compare to traditional inductor-based designs?

Compared to traditional non-coupled inductor-based designs, Infineon’s TLVR solution offers:

  • Instant response to dynamic load changes with minimal output capacitance
  • Significant reduction in overall solution size and BOM cost
  • Enhanced efficiency and lower TCO through lower switching frequencies

Concisely, TLVR configuration enables efficient, high-density, and cost-effective power management solutions for a high-performance data center network switch.

Power delivery network (PDN) delivers power from the voltage regulator to the CPU and other components on the server motherboard. It ensures efficient, reliable power distribution and plays a vital role in meeting stringent voltage deviation specifications for data center network switch applications that require multiphase buck converters to manage high di/dt load steps.

What are the PDN challenges in data center network switches?

  • Fast transient voltage stability 
  • Inductor limited transient response 
  • Regulator placement dependency 
  • High current scalability limits

How to mitigate PDN challenges in multiphase DC‑DC processor power systems? 

TLVR addresses PDN challenge using transformers with a 1:1 turns ratio instead of traditional inductors. This approach improves transient response and enables better voltage regulation without needing you to place the multiphase voltage regulator closer to the processor.

TLVR also enables reliable voltage regulation for AI processors requiring 200 A to 1000 A under highly dynamic load conditions. 

This capability supports a scalable and reliable power infrastructure for next generation data center switch architecture.

Infineon’s second-gen DC-DC power modules OptiMOS™ TDM2354xD and TDM2354xT are designed to lower TCO in generative AI factories and high-performance data center network switch systems. 

These 160 A modules integrate two OptiMOS™ 6 power stages, inductors, and capacitors on a single substrate, enabling two phases of a multiphase buck regulator in a compact footprint, 40% smaller than equivalent discrete solutions .

Why are quad phase power modules essential for high current, high density AI workloads?

For higher power requirements, Infineon’s OptiMOS™ TDM2454xx quad-phase modules deliver peak currents up to 280 A and exceptional power density of 2.0 A/mm² in a compact package optimized for vertical power delivery (VPD) architectures. 

In addition, OptiMOS™ TDM2454xx modules feature industry-leading power density, proprietary magnetics for low-profile VPD, and a footprint optimized for tiling arrays of modules. 

The modules feature Infineon’s proprietary inductor-on-top design that improves thermal performance while supporting high-density AI workloads. Also, Infineon's robust OptiMOS™ 6 trench technology and chip-embedded package enhance electrical and thermal efficiencies.

High-efficiency LV DC-DC power is critical for delivering the high density and low latency required to optimize data center network switch performance under dynamic and high-bandwidth loads.

Infineon offers a comprehensive portfolio featuring:

  • XDP™ digital multiphase controllers: For precise and programmable power management 
  • OptiMOS™ integrated smart power stages: To maximize efficiency in compact footprint
  • High-density dual- or quad-phase power modules: Engineered for space-constrained environments

Infineon's solutions for core and other rails used in data center network architecture 

  • Superior power conversion efficiency: Reduces thermal load and operational costs
  • Ultra-fast transient response speed: Ensures voltage stability during rapid SoC load changes
  • Precise telemetry reporting: Enables real-time health monitoring and predictive maintenance

Furthermore, maximize the efficiency of your data center network architecture with core power solutions that leverage trans-inductor voltage regulation (TLVR) technology. This approach supports high-current SoC performance while significantly reducing output capacitance, lowering total BOM costs, and valuable PCB space.

TLVR is a high-speed power delivery topology that utilizes magnetically coupled inductors to provide the ultra-fast transient response and reduced capacitance required by high-current ASICs in modern data center switch architecture. 

Infineon implements this TLVR solution for high-performance systems by combining XDP™ digital power controllers with OptiMOS™ power stages.

How does TLVR compare to traditional inductor-based designs?

Compared to traditional non-coupled inductor-based designs, Infineon’s TLVR solution offers:

  • Instant response to dynamic load changes with minimal output capacitance
  • Significant reduction in overall solution size and BOM cost
  • Enhanced efficiency and lower TCO through lower switching frequencies

Concisely, TLVR configuration enables efficient, high-density, and cost-effective power management solutions for a high-performance data center network switch.

Power delivery network (PDN) delivers power from the voltage regulator to the CPU and other components on the server motherboard. It ensures efficient, reliable power distribution and plays a vital role in meeting stringent voltage deviation specifications for data center network switch applications that require multiphase buck converters to manage high di/dt load steps.

What are the PDN challenges in data center network switches?

  • Fast transient voltage stability 
  • Inductor limited transient response 
  • Regulator placement dependency 
  • High current scalability limits

How to mitigate PDN challenges in multiphase DC‑DC processor power systems? 

TLVR addresses PDN challenge using transformers with a 1:1 turns ratio instead of traditional inductors. This approach improves transient response and enables better voltage regulation without needing you to place the multiphase voltage regulator closer to the processor.

TLVR also enables reliable voltage regulation for AI processors requiring 200 A to 1000 A under highly dynamic load conditions. 

This capability supports a scalable and reliable power infrastructure for next generation data center switch architecture.

Infineon’s second-gen DC-DC power modules OptiMOS™ TDM2354xD and TDM2354xT are designed to lower TCO in generative AI factories and high-performance data center network switch systems. 

These 160 A modules integrate two OptiMOS™ 6 power stages, inductors, and capacitors on a single substrate, enabling two phases of a multiphase buck regulator in a compact footprint, 40% smaller than equivalent discrete solutions .

Why are quad phase power modules essential for high current, high density AI workloads?

For higher power requirements, Infineon’s OptiMOS™ TDM2454xx quad-phase modules deliver peak currents up to 280 A and exceptional power density of 2.0 A/mm² in a compact package optimized for vertical power delivery (VPD) architectures. 

In addition, OptiMOS™ TDM2454xx modules feature industry-leading power density, proprietary magnetics for low-profile VPD, and a footprint optimized for tiling arrays of modules. 

The modules feature Infineon’s proprietary inductor-on-top design that improves thermal performance while supporting high-density AI workloads. Also, Infineon's robust OptiMOS™ 6 trench technology and chip-embedded package enhance electrical and thermal efficiencies.

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