Space memory portfolio

Radiation hardened non-volatile and volatile memory portfolio

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Overview

Our HiRel space memories are used throughout satellite sub-systems. Whether you are designing satellite payloads, buses, communications, or other spacecraft systems, our memories provide the highest reliability, highest performance, and superior radiation and single event effects (SEE) performance on the market.  We adhere to the most stringent standards in the industry and are DLAM QML certified, meeting the reliability and life cycle demands for space applications.

Key Features

  • Designed with RADSTOP™ technology
  • Assembled and tested in the U.S.
  • Space flight heritage
  • Broad ECO system support

Products

About

Rad hard, rad tol memory solutions for space, satellite applications

Our HiRel space memories are used throughout satellite sub-systems. Whether you are designing satellite payloads, buses, communications, or other spacecraft systems, our memories provide the highest reliability, highest performance, and superior radiation and single event effects (SEE) performance on the market.  We adhere to the most stringent standards in the industry and are DLAM QML certified, meeting the reliability and life cycle demands for space applications.

High reliability forum
Infineon's rad hard and rad tol memory portfolio
  • Rad tol, non-volatile NOR flash:  Low-pin count, high performance, industry-standard QSPI and dual QSPI interfaces for easy adoption and use
  • Rad hard, non-volatile, ferroelectric-RAM (F-RAM):  Virtually infinite endurance, SEU immune with >100 year data retention making it one of the highest reliability memories for space
  • Rad hard, volatile, Quad Data Rate (QDR®) synchronous SRAM: Low latency, industry-leading performance and on-chip ECC for high reliability
  • Rad hard, volatile, asynchronous FAST SRAM: Industry-leading access rates and low power
Radiation hard products assembled and tested in the U.S.

Wafer fabs:

  • Skywater, Minnesota, USA
  • UMC, Tainan, Taiwan
  • Texas Instruments, Dallas, USA                                                                                                                       

Assembly and test facilities:

  • DPA Components International, Simi Valley, USA
  • Micross Components, Orlando, USA
  • Infineon San Jose Test, San Jose, USA

Multiple wafer SORT and auxiliary manufacturing facilities:

  • Skywater, ChipMOS, KYEC for SORT
  • UTAC, Thailand and Integra, Milpitas, USA for laser groove and die separation
Radiation hard products assembled and tested in US
Radiation-hardened product resources summary

Radiation Resistance (TID, SEE)

  • Total Dose (TID) Radiation: Resistance to permanent device damage caused by exposure to radiation (ions) over the life of the device. A trapped positive charge can result in field device turn-on. Infineon radiation-hardened SRAMs can operate up to a total dose of 300 Krad.
  • Single Event Effects (SEE): Loss of data and possible physical device damage caused by the impact of radiation particle (heavy ions, protons, or neutrons) which may result in device latch-up where a high current state is observed.

QML-V & QML-Q Screening

  • QML certification is the highest standard of reliability for microcircuit devices issue by the United States government. This certification indicates that the device can be relied upon to function properly while being subjected to the harshest of conditions. Infineon’s radiation-hardened SRAMs feature both the QML-V and QML-Q certifications.

Datapack

  • Infineon offers the option of purchasing a datapack with all QML-certified products. This datapack tabulates data gathered during the part certification process including radiation data, read and record electrical data, and tri-temperature test data. The datapack is offered in both hard and soft copy formats and is matched to individual part serial numbers.

Memory Controller

  • Memory controllers are available free of charge for Xilinx Virtex V5, Kintex US as well as for Microchip RTG4 FPGA’s for the RadHard 72M and 144M QDRII+ SRAM devices. The QDR-II+ SRAM controllers manage the intricate timing details of a DDR-based source synchronous timing architecture and ensure reliable data traffic between the FPGA and the QDRII+ SRAM memory. Controller embedded ECC (SECDEC) is also available as an RTL option if a higher level of radiation immunity is required to mitigate single event effects. Please contact hirel-memory@infineon.com for a copy of the RTL code and test bench.

 

Pre-qualified solutions and reference designs

Infineon works with chipset partners worldwide to qualify our memories, validate drivers and software, and develop turnkey reference designs. The result is a suite of tools and resources that simplify the design process and reduce the time to market. To help you select recommended and qualified memory for your chipset, Infineon publishes chipset pairing guides. These spreadsheets map which Infineon memory products have been qualified with which partner chipsets.

View pre-qualified memories for your chipset
Learn more about ECO System /DevKit Support

Supported Space FPGA’s

 

DevKit Mezzanine Cards

CYDK-QDRII-NODT - Memories - On request

QDR-II+ Synchronous SRAM mezzanine card for testing the highest performing memory for space applications This devkit board has been developed to work with the Infineon Rad Hard 72 & 144-Mbit QDR®-II+ Synchronous SRAMs. The board is developed and tested to work with FPGA carrier cards through the FMC-HPC connector.
 

CYDK-QDRII-LA - Memories - On request

QDR-II+ Synchronous SRAM Logic Analyzer mezzanine card for connecting a logic analyzer to debug the Rad Hard QDR®-II+ Synchronous SRAM interface to the CYDK-QDRII-NODT. This logic analyzer card has been developed to work with the Infineon CYDK-QDRII-NODT mezzanine card to provide a path to debug the interface between the FPGA and Rad Hard QDR®-II+ Synchronous SRAM. The board is developed and tested to work with FPGA carrier cards through the FMC-HPC connector.

CYDK-NOR - Memories - On request

NOR Flash Boot Configuration mezzanine card for NOR Flash used as FPGA configuration memory. This devkit board has been developed to work with the Infineon Radiation Tolerant 256Mb and 512 Mb NOR Flash memory devices. The board is developed and tested to work with Xilinx FPGA carrier cards through the FMC-HPC connector.

Please contact our IR HiRel Representative Office


Supported DevKits:


Xilinx FPGA Boot Configuration Support

The QSPI and Dual QSPI NOR Flash memory devices can be programmed either through the FPGA or directly with an external SPI programmer. Details can be found in the Application Note below:

NOR Flash Programming Options AppNote

Rad hard, rad tol memory solutions for space, satellite applications

Our HiRel space memories are used throughout satellite sub-systems. Whether you are designing satellite payloads, buses, communications, or other spacecraft systems, our memories provide the highest reliability, highest performance, and superior radiation and single event effects (SEE) performance on the market.  We adhere to the most stringent standards in the industry and are DLAM QML certified, meeting the reliability and life cycle demands for space applications.

High reliability forum

Infineon's rad hard and rad tol memory portfolio
  • Rad tol, non-volatile NOR flash:  Low-pin count, high performance, industry-standard QSPI and dual QSPI interfaces for easy adoption and use
  • Rad hard, non-volatile, ferroelectric-RAM (F-RAM):  Virtually infinite endurance, SEU immune with >100 year data retention making it one of the highest reliability memories for space
  • Rad hard, volatile, Quad Data Rate (QDR®) synchronous SRAM: Low latency, industry-leading performance and on-chip ECC for high reliability
  • Rad hard, volatile, asynchronous FAST SRAM: Industry-leading access rates and low power

Radiation hard products assembled and tested in the U.S.

Wafer fabs:

  • Skywater, Minnesota, USA
  • UMC, Tainan, Taiwan
  • Texas Instruments, Dallas, USA                                                                                                                       

Assembly and test facilities:

  • DPA Components International, Simi Valley, USA
  • Micross Components, Orlando, USA
  • Infineon San Jose Test, San Jose, USA

Multiple wafer SORT and auxiliary manufacturing facilities:

  • Skywater, ChipMOS, KYEC for SORT
  • UTAC, Thailand and Integra, Milpitas, USA for laser groove and die separation
Radiation hard products assembled and tested in US

Radiation-hardened product resources summary

Radiation Resistance (TID, SEE)

  • Total Dose (TID) Radiation: Resistance to permanent device damage caused by exposure to radiation (ions) over the life of the device. A trapped positive charge can result in field device turn-on. Infineon radiation-hardened SRAMs can operate up to a total dose of 300 Krad.
  • Single Event Effects (SEE): Loss of data and possible physical device damage caused by the impact of radiation particle (heavy ions, protons, or neutrons) which may result in device latch-up where a high current state is observed.

QML-V & QML-Q Screening

  • QML certification is the highest standard of reliability for microcircuit devices issue by the United States government. This certification indicates that the device can be relied upon to function properly while being subjected to the harshest of conditions. Infineon’s radiation-hardened SRAMs feature both the QML-V and QML-Q certifications.

Datapack

  • Infineon offers the option of purchasing a datapack with all QML-certified products. This datapack tabulates data gathered during the part certification process including radiation data, read and record electrical data, and tri-temperature test data. The datapack is offered in both hard and soft copy formats and is matched to individual part serial numbers.

Memory Controller

  • Memory controllers are available free of charge for Xilinx Virtex V5, Kintex US as well as for Microchip RTG4 FPGA’s for the RadHard 72M and 144M QDRII+ SRAM devices. The QDR-II+ SRAM controllers manage the intricate timing details of a DDR-based source synchronous timing architecture and ensure reliable data traffic between the FPGA and the QDRII+ SRAM memory. Controller embedded ECC (SECDEC) is also available as an RTL option if a higher level of radiation immunity is required to mitigate single event effects. Please contact hirel-memory@infineon.com for a copy of the RTL code and test bench.

 

Pre-qualified solutions and reference designs

Infineon works with chipset partners worldwide to qualify our memories, validate drivers and software, and develop turnkey reference designs. The result is a suite of tools and resources that simplify the design process and reduce the time to market. To help you select recommended and qualified memory for your chipset, Infineon publishes chipset pairing guides. These spreadsheets map which Infineon memory products have been qualified with which partner chipsets.

View pre-qualified memories for your chipset

Learn more about ECO System /DevKit Support

Supported Space FPGA’s

 

DevKit Mezzanine Cards

CYDK-QDRII-NODT - Memories - On request

QDR-II+ Synchronous SRAM mezzanine card for testing the highest performing memory for space applications This devkit board has been developed to work with the Infineon Rad Hard 72 & 144-Mbit QDR®-II+ Synchronous SRAMs. The board is developed and tested to work with FPGA carrier cards through the FMC-HPC connector.
 

CYDK-QDRII-LA - Memories - On request

QDR-II+ Synchronous SRAM Logic Analyzer mezzanine card for connecting a logic analyzer to debug the Rad Hard QDR®-II+ Synchronous SRAM interface to the CYDK-QDRII-NODT. This logic analyzer card has been developed to work with the Infineon CYDK-QDRII-NODT mezzanine card to provide a path to debug the interface between the FPGA and Rad Hard QDR®-II+ Synchronous SRAM. The board is developed and tested to work with FPGA carrier cards through the FMC-HPC connector.

CYDK-NOR - Memories - On request

NOR Flash Boot Configuration mezzanine card for NOR Flash used as FPGA configuration memory. This devkit board has been developed to work with the Infineon Radiation Tolerant 256Mb and 512 Mb NOR Flash memory devices. The board is developed and tested to work with Xilinx FPGA carrier cards through the FMC-HPC connector.

Please contact our IR HiRel Representative Office


Supported DevKits:


Xilinx FPGA Boot Configuration Support

The QSPI and Dual QSPI NOR Flash memory devices can be programmed either through the FPGA or directly with an external SPI programmer. Details can be found in the Application Note below:

NOR Flash Programming Options AppNote

Documents

Documents

Design resources

Developer community

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