Smart card modules

We offer field-proven, plug & play packaging technology for high performing smart cards.

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Innovative modules for payment applications

The migration to contactless is driving the payment industry. Contactless technologies are inspiring new and innovative form factors, also supporting additional use cases alongside payment. Infineon’s payment solutions, with its excellent technology backed by extensive services and design-in support, enable contactless payment functionality to be integrated into almost anything.

Our chip modules in combination with the security controllers enable: 

  •  Contactless transformation for payment
  •  Outstanding contactless transaction speeds and superior performance.
  •  Innovations for new payment use cases, such as wearables or other form factors. 
  •  While using standardized inlays the card production is fast and easy. 
  •  High card robustness and long lifetime thanks to the flexibility in the card design. 

The ultimative inductive coupling technology from Infineon consolidates all these values in a unique package offering to improve the customer experience and bring it into the next level of convinience. 

Ultra-thin modules for more efficient transport

The future of transport ticketing will be driven by convenience, security, and speed. Multi-modal services which can be accessed with one single form factor – whether as chip paper ticket, smart card, mobile phone or wearable - are required to address future market needs. These multi-purpose devices have to combine the security associated with payment applications with the speed and performance of typical contactless ticketing schemes. This calls for new, more robust, and faster security solutions capable of protecting passenger credentials and saving operators costs.

The main current urban challenge is the transformation towards smart mobility, along with digitalization and the adoption of open standards under a secured environment.

Higher passengers throughput and an optimized design for convenient ticketing are key success factors to support these trends.

Our ultra-thin packaging offerings from Infineon enable ticketing with:

  •  Very flexible designs which can be used in more sustainable tickets.
  •  Highest performance
  •  Robustness for long lasting lifetime in the market 
  •  New form factors to enable innovations and other ticket formats, including wearables.
Innovative and robust modules for your Goverment applications

With globalization thriving further and further, the demand for electronic goverment documents is also increasing rapidly. We from Infineon offer you a broad and innovative portfolio of form factors for your goverment application. This ranges from standard dual interface modules to high performance modules with inductive coupling technologies (coil on module). We offer full solutions like chip, module and antenna and all this is backed by extensive services and design-in support. Our chip modules in combination with the security controllers enable: 

  •  Highest performance
  •  Maximum manufacturing flexibility
  •  High card robustness with lifetimes up to 10 years
  •  Universal card antennas

Innovative modules for payment applications

The migration to contactless is driving the payment industry. Contactless technologies are inspiring new and innovative form factors, also supporting additional use cases alongside payment. Infineon’s payment solutions, with its excellent technology backed by extensive services and design-in support, enable contactless payment functionality to be integrated into almost anything.

Our chip modules in combination with the security controllers enable: 

  •  Contactless transformation for payment
  •  Outstanding contactless transaction speeds and superior performance.
  •  Innovations for new payment use cases, such as wearables or other form factors. 
  •  While using standardized inlays the card production is fast and easy. 
  •  High card robustness and long lifetime thanks to the flexibility in the card design. 

The ultimative inductive coupling technology from Infineon consolidates all these values in a unique package offering to improve the customer experience and bring it into the next level of convinience. 

Ultra-thin modules for more efficient transport

The future of transport ticketing will be driven by convenience, security, and speed. Multi-modal services which can be accessed with one single form factor – whether as chip paper ticket, smart card, mobile phone or wearable - are required to address future market needs. These multi-purpose devices have to combine the security associated with payment applications with the speed and performance of typical contactless ticketing schemes. This calls for new, more robust, and faster security solutions capable of protecting passenger credentials and saving operators costs.

The main current urban challenge is the transformation towards smart mobility, along with digitalization and the adoption of open standards under a secured environment.

Higher passengers throughput and an optimized design for convenient ticketing are key success factors to support these trends.

Our ultra-thin packaging offerings from Infineon enable ticketing with:

  •  Very flexible designs which can be used in more sustainable tickets.
  •  Highest performance
  •  Robustness for long lasting lifetime in the market 
  •  New form factors to enable innovations and other ticket formats, including wearables.

Innovative and robust modules for your Goverment applications

With globalization thriving further and further, the demand for electronic goverment documents is also increasing rapidly. We from Infineon offer you a broad and innovative portfolio of form factors for your goverment application. This ranges from standard dual interface modules to high performance modules with inductive coupling technologies (coil on module). We offer full solutions like chip, module and antenna and all this is backed by extensive services and design-in support. Our chip modules in combination with the security controllers enable: 

  •  Highest performance
  •  Maximum manufacturing flexibility
  •  High card robustness with lifetimes up to 10 years
  •  Universal card antennas

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