Interface protection

Maximum interface ESD protection for IoT-enabling mobile devices and smartphones from Infineon, a market leader in ESD protection diodes

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Overview

Miniaturization and integration combined with their general complexity make present-day mobile devices much more sensitive to ESD. The result: you must protect different interfaces from various ESD or surge scenarios without impacting signal integrity (SI). This requires TVS diodes with the right level of protection along with performance and price. Infineon offers the perfect ESD protection diodes for use in mobile devices and smartphones.

Benefits

  • ESD absorption up to ±30 kV
  • World's smallest TVS diodes
  • Surge absorption up to ±12 A
  • Ultra-low dynamic resistance
  • Safe and stable clamping voltage
  • Fast response times below 1 ns
  • High-speed signal integrity
  • Ultra-low leakage current
  • Save PCB space
  • Ultra-low profile
  • Exceeds IEC 61000-4-2 standard
  • Meets EC 61000-4-5 standard

Block diagram

About

In a mobile device or smartphone, there are many open access points such as the charging port, microphones, and buttons that could permit ESD strikes to reach the inner PCB. Often the point of entrance for an ESD strike is not obvious, but almost always originates from anywhere the device interfaces with the user. Therefore, Infineon ESD protection devices improve ESD immunity at the system level by providing first-class protection beyond the IEC61000-4-2 level-4 standard, and offer: 

  • Superior multi-strike absorption capability 
  • Safe and stable clamping voltages to protect even the most sensitive electronic equipment 
  • Full compliance with high-speed signal quality requirements 
  • Efficient PCB space usage thanks to small 0201 and 01005 package dimensions 
  • Extremely low leakage currents to extend battery life

Infineon's TVS diodes in chip scale package (CSP) withstand thousands of ESD strikes exceeding the toughest level of the IEC 61000-4-2 standard. Superior system protection is ensured thanks to low clamping voltages and ultra-low dynamic resistance down to 0.09 ohm. Diodes with ultra-low capacitance are the preferred solution for optimal signal integrity in high-speed and RF interface applications.

To limit the power consumption and extend battery duration, electronic hardware designers are looking to reduce leakage current drained by small components in routing operation mode. Infineon TVS diodes in CSP with leakage currents down to less than 1 nA represent a significant benefit for battery-powered electronics such as smartphones and mobile devices.

To provide proper ESD protection for the inner PCB, it is mandatory to place fast-responding TVS protection diodes at specific locations. General-purpose TVS diodes can be used for general-purpose interfaces, depending on the position to be protected (for example, where the signal frequency is low and therefore device capacitance does not matter).

On the other hand, dedicated low-capacitance TVS diodes must be used for high-speed data lines and RF interfaces to avoid any impact on signal integrity. The higher the data rate, the more the device capacitance matters. 

Infineon covers both of these categories with our broad portfolio of ESD protection diodes for I/O, audio, USB, RF, video, NFC, memory, power, and more.

Infineon offers the world’s smallest TVS diodes, which are available in 01005 and 0201 EIA-equivalent packages. These TVS diodes in chip scale packages measure just 0.43 x 0.23 mm for WLL-2-2 (thin super-small leadless package) and 0.58 x 0.28 mm for WLL-2-1 and WLL-2-3 (thin small leadless package). With their small size and underneath electrode pad design, these devices boast of true space savings in highly dense PCBs. In addition, the package’s height is a key element of the design of modern electronic equipment. With only 0.15 mm thickness, these WLL packages are the solution of preference for many major manufacturers of slim electronics. WLL-2 diode packages are RoHS-compliant and halogen-free. They are suitable for all most used variations of pick-and-place assembly.

In a mobile device or smartphone, there are many open access points such as the charging port, microphones, and buttons that could permit ESD strikes to reach the inner PCB. Often the point of entrance for an ESD strike is not obvious, but almost always originates from anywhere the device interfaces with the user. Therefore, Infineon ESD protection devices improve ESD immunity at the system level by providing first-class protection beyond the IEC61000-4-2 level-4 standard, and offer: 

  • Superior multi-strike absorption capability 
  • Safe and stable clamping voltages to protect even the most sensitive electronic equipment 
  • Full compliance with high-speed signal quality requirements 
  • Efficient PCB space usage thanks to small 0201 and 01005 package dimensions 
  • Extremely low leakage currents to extend battery life

Infineon's TVS diodes in chip scale package (CSP) withstand thousands of ESD strikes exceeding the toughest level of the IEC 61000-4-2 standard. Superior system protection is ensured thanks to low clamping voltages and ultra-low dynamic resistance down to 0.09 ohm. Diodes with ultra-low capacitance are the preferred solution for optimal signal integrity in high-speed and RF interface applications.

To limit the power consumption and extend battery duration, electronic hardware designers are looking to reduce leakage current drained by small components in routing operation mode. Infineon TVS diodes in CSP with leakage currents down to less than 1 nA represent a significant benefit for battery-powered electronics such as smartphones and mobile devices.

To provide proper ESD protection for the inner PCB, it is mandatory to place fast-responding TVS protection diodes at specific locations. General-purpose TVS diodes can be used for general-purpose interfaces, depending on the position to be protected (for example, where the signal frequency is low and therefore device capacitance does not matter).

On the other hand, dedicated low-capacitance TVS diodes must be used for high-speed data lines and RF interfaces to avoid any impact on signal integrity. The higher the data rate, the more the device capacitance matters. 

Infineon covers both of these categories with our broad portfolio of ESD protection diodes for I/O, audio, USB, RF, video, NFC, memory, power, and more.

Infineon offers the world’s smallest TVS diodes, which are available in 01005 and 0201 EIA-equivalent packages. These TVS diodes in chip scale packages measure just 0.43 x 0.23 mm for WLL-2-2 (thin super-small leadless package) and 0.58 x 0.28 mm for WLL-2-1 and WLL-2-3 (thin small leadless package). With their small size and underneath electrode pad design, these devices boast of true space savings in highly dense PCBs. In addition, the package’s height is a key element of the design of modern electronic equipment. With only 0.15 mm thickness, these WLL packages are the solution of preference for many major manufacturers of slim electronics. WLL-2 diode packages are RoHS-compliant and halogen-free. They are suitable for all most used variations of pick-and-place assembly.

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