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Automotive LIN LDO transceivers
LIN transceiver with integrated LDO for compact and cost-efficient automotive ECUs
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On this page
Overview
Automotive body and comfort electronics rely on a two-chip architecture at every LIN slave node: a transceiver on the 12 V bus, an LDO regulating the microcontroller supply. The TLE8457x integrates both into one AEC-Q100 qualified package — reducing board area, simplifying the BOM, and cutting qualification overhead across every node in the system.
Key Features
- LIN transceiver + LDO in one chip
- Single 3.0 × 3.0 mm package
- 3.3 V and 5 V output options
- 70 mA LDO output current
- 7 µA quiescent current in sleep mode
- Integrated initialization timeout
- 1 µF output capacitor only
- LIN 2.x and SAE J2602 compliant
- Standard TSON-8 and DSO-8 packages
Benefits
- Lower BOM, smaller footprint
- Up to 50% less PCB area
- Broad MCU compatibility
- Direct MCU powering
- Low standby current compliance
- Lower count, enhanced robustness
- Minimal BOM, low cost
- Seamless LIN integration
- Fast migration & design reuse
Products
About
Most LIN slave nodes require two components side by side: a LIN transceiver connected to the 12 V vehicle bus, and an LDO voltage regulator stepping that supply down to 3.3 V or 5 V for the microcontroller. Each adds a PCB footprint, a BOM line, and a separate AEC-Q100 qualification.
The TLE8457x family integrates both functions into a single chip. One TSON-8 or DSO-8 package replaces two — combining a LIN transceiver with a 70 mA LDO in a compact, AEC-Q100 qualified device.
The result is a simpler design, a smaller board, and a shorter BOM — without changing the function your LIN slave node already needs.
Replacing two discrete components with the TLE8457x delivers measurable savings across three dimensions.
PCB footprint: the discrete approach occupies approximately 7.5 x 3.0 mm of board area plus inter-chip routing traces. The TLE8457x uses a single 3.0 x 3.0 mm footprint, reducing board area by up to 50%.
BOM and supply chain: two part numbers, two AEC-Q100 qualifications, and two supplier relationships become one. Layout engineers eliminate inter-chip routing. Procurement manages a single SKU.
Unit cost: at production volumes, the integrated TLE8457x comes in significantly below the combined discrete pair.
Key savings:
- PCB area reduction: up to 50%
- AEC-Q100 qualifications: 1 instead of 2
- Unit cost: 50-60% saving
- Unit cost: significantly lower than discrete pair at volume
The TLE8457x is designed for automotive LIN slave nodes where board space and power consumption are constrained.
Key features across all variants:
- LIN transceiver compliant with LIN 2.2 and SAE J2602
- Integrated LDO: 70 mA output current, 3.3 V or 5 V output (variant-dependent)
- Very low quiescent current: 7 uA typical — optimised for nodes in extended sleep mode
- Integrated initialization timeout — startup protection without external supervisor components
- Minimal external BOM: only a 1 uF output capacitor required
- Available in TSON-8 (4 variants) and DSO-8 (2 variants) packages
The 7 uA quiescent current is particularly relevant for LIN slave nodes that spend the majority of their operating life in standby.
The TLE8457x targets LIN slave nodes in automotive body electronics — applications where a LIN bus interface and a regulated supply for the microcontroller are both required in a compact and cost-optimised package.
Primary application areas:
- Seat position and comfort controllers (adjustment motors, heating control)
- Door modules (central locking, mirror adjustment, window lift)
- Window lift control units
- Interior and ambient lighting control
- Climate and ventilation slave nodes
- Sunroof and panoramic roof control
The LIN bus topology — 1 master, up to 16 slave nodes — means these integrated devices can populate an entire body comfort network with a single, consistent BOM entry.
The TLE8457x is offered in industry-standard TSON-8 and DSO-8 packages — the same physical footprints widely used across LIN transceiver and LDO families in the market.
This packaging choice simplifies transition for designs already using separate LIN and LDO components in compatible package formats. The physical layout footprint is preserved; the routing between two chips is eliminated.
For new designs, integration is the natural starting point. For existing designs on equivalent package outlines, evaluation requires no PCB respin — the board footprint is already in place.
Infineon supports the migration with datasheets, reference schematics, and application notes covering power budget, PCB layout guidance, and LIN bus interface configuration. The TLE8457x is LIN 2.2 and SAE J2602 compliant.
Integration makes sense when a LIN slave node requires a LIN transceiver and a regulated supply for the microcontroller — and nothing more. In this configuration, the TLE8457x covers both functions at lower total cost, lower board area, and reduced qualification effort compared to two discrete components.
For the majority of body comfort LIN slave nodes — seat controllers, door modules, window switches — 70 mA at 3.3 V or 5 V is sufficient, and integration is the preferred solution.
Speed-up your project by using our community platform for learning and sharing the latest product, software, and application information.
Automotive designs require long-term component availability. Infineon's longevity program ensures planned long-term availability for the automotive LIN LDO voltage regulator product portfolio and other automotive products - enabling confident supply chain planning across the full vehicle lifecycle.
Find information relating to the planned long-term availability of semiconductor products “longevity” for automotive products.
Most LIN slave nodes require two components side by side: a LIN transceiver connected to the 12 V vehicle bus, and an LDO voltage regulator stepping that supply down to 3.3 V or 5 V for the microcontroller. Each adds a PCB footprint, a BOM line, and a separate AEC-Q100 qualification.
The TLE8457x family integrates both functions into a single chip. One TSON-8 or DSO-8 package replaces two — combining a LIN transceiver with a 70 mA LDO in a compact, AEC-Q100 qualified device.
The result is a simpler design, a smaller board, and a shorter BOM — without changing the function your LIN slave node already needs.
Replacing two discrete components with the TLE8457x delivers measurable savings across three dimensions.
PCB footprint: the discrete approach occupies approximately 7.5 x 3.0 mm of board area plus inter-chip routing traces. The TLE8457x uses a single 3.0 x 3.0 mm footprint, reducing board area by up to 50%.
BOM and supply chain: two part numbers, two AEC-Q100 qualifications, and two supplier relationships become one. Layout engineers eliminate inter-chip routing. Procurement manages a single SKU.
Unit cost: at production volumes, the integrated TLE8457x comes in significantly below the combined discrete pair.
Key savings:
- PCB area reduction: up to 50%
- AEC-Q100 qualifications: 1 instead of 2
- Unit cost: 50-60% saving
- Unit cost: significantly lower than discrete pair at volume
The TLE8457x is designed for automotive LIN slave nodes where board space and power consumption are constrained.
Key features across all variants:
- LIN transceiver compliant with LIN 2.2 and SAE J2602
- Integrated LDO: 70 mA output current, 3.3 V or 5 V output (variant-dependent)
- Very low quiescent current: 7 uA typical — optimised for nodes in extended sleep mode
- Integrated initialization timeout — startup protection without external supervisor components
- Minimal external BOM: only a 1 uF output capacitor required
- Available in TSON-8 (4 variants) and DSO-8 (2 variants) packages
The 7 uA quiescent current is particularly relevant for LIN slave nodes that spend the majority of their operating life in standby.
The TLE8457x targets LIN slave nodes in automotive body electronics — applications where a LIN bus interface and a regulated supply for the microcontroller are both required in a compact and cost-optimised package.
Primary application areas:
- Seat position and comfort controllers (adjustment motors, heating control)
- Door modules (central locking, mirror adjustment, window lift)
- Window lift control units
- Interior and ambient lighting control
- Climate and ventilation slave nodes
- Sunroof and panoramic roof control
The LIN bus topology — 1 master, up to 16 slave nodes — means these integrated devices can populate an entire body comfort network with a single, consistent BOM entry.
The TLE8457x is offered in industry-standard TSON-8 and DSO-8 packages — the same physical footprints widely used across LIN transceiver and LDO families in the market.
This packaging choice simplifies transition for designs already using separate LIN and LDO components in compatible package formats. The physical layout footprint is preserved; the routing between two chips is eliminated.
For new designs, integration is the natural starting point. For existing designs on equivalent package outlines, evaluation requires no PCB respin — the board footprint is already in place.
Infineon supports the migration with datasheets, reference schematics, and application notes covering power budget, PCB layout guidance, and LIN bus interface configuration. The TLE8457x is LIN 2.2 and SAE J2602 compliant.
Integration makes sense when a LIN slave node requires a LIN transceiver and a regulated supply for the microcontroller — and nothing more. In this configuration, the TLE8457x covers both functions at lower total cost, lower board area, and reduced qualification effort compared to two discrete components.
For the majority of body comfort LIN slave nodes — seat controllers, door modules, window switches — 70 mA at 3.3 V or 5 V is sufficient, and integration is the preferred solution.
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Automotive designs require long-term component availability. Infineon's longevity program ensures planned long-term availability for the automotive LIN LDO voltage regulator product portfolio and other automotive products - enabling confident supply chain planning across the full vehicle lifecycle.
Find information relating to the planned long-term availability of semiconductor products “longevity” for automotive products.
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