Automotive head unit

Accelerate next-gen automotive infotainment head unit system designs

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Overview

Automotive head unit systems offer a multi-faceted infotainment experience. Advanced human-machine interfaces (HMI)s with seamless connectivity ensure touch, voice, and gesture control. Cybersecurity protects privacy and defends against attacks in a connected environment. Our automotive head unit product portfolio, including HMI controllers, sensors, Wi-Fi & Bluetooth® SoCs, security ICs, memory solutions, and power products, enables next-generation designs and robust car connection.

Benefits

  • Highly scalable TRAVEO™ 32-bit MCUs
  • Safe and secure SEMPER™ NOR flash
  • AIROC™ Wi-Fi & Bluetooth® solutions
  • XENSIV™ silicon microphones
  • 32-bit PSOC™ multitouch controller
  • Extendable security solutions
  • Leading edge power IC solutions

Block diagram

About

Our broad IC portfolio covers essential automotive head unit functions

Computing: The TRAVEO™ T2G-B MCU family offers high performance (up to dual Arm® Cortex®-M7, 1500 DMIPs), wide scalability (memory density and package line-up), best-in-class energy efficiency (deep sleep mode: 35 µA, hibernate mode: 5 µA), ASIL-B functional safety and an integrated hardware security module (HSM).

Sensors: The PSOC™ automotive family offers in-cabin touch solutions from one source. Automotive-qualified MEMS microphone sensors provide supreme audio reception in dynamic environments.

Connectivity and communication: Broad Wi-Fi and Bluetooth® portfolio supports various in-cabin wireless connections. CAN, LIN transceivers, and system basis chip (SBC) families connect the head unit to in-vehicle networking.

Power supply: OPTIREG™ PMIC, linear, and switcher devices support reliable power supply. USB-C PD controllers support fast charging (up to 100 W) with best-in-class interoperability and compliance with all kinds of mobile devices.

Storage: Broad automotive-qualified NOR flash, SRAM, and F-RAM portfolio provides safe, secure, and reliable data storage.

Infineon's IC solutions reduce R&D effort and increase competitiveness

Infineon offers a comprehensive portfolio of automotive head unit solutions, empowering you to accelerate time-to-market while maintaining a competitive edge in the rapidly evolving in-car infotainment landscape.

Scalability: Scalable family solutions with wide compatibilities on both hardware and software support designs from low- to high-end systems with less design effort.

Performance: Best-in-class performance of sensing solutions (touchscreens, microphones, etc.), wireless solutions (Wi-Fi and Bluetooth®), and fast-charging solutions (USB-C PD) improves customer experience significantly.

Security: Secured MCU, secured memory, and secured connectivity support secured firmware updates over-the-air (FOTA), and safeguard consumers from cyber-attacks.

Total cost of ownership: Broad portfolio provides a one-stop shop on both commercial and technical level which significantly reduce purchase costs as well as system design effort.

AIROC™ Wi-Fi and Bluetooth® solutions for robust connectivity

Infineon is leading in real simultaneous dual band (RSDB) solutions providing simultaneous operation in both 2.4 GHz and 5 GHz bands, as well as multiple-input multiple-output (MIMO) support. RSDB solutions provide the necessary bandwidth and the software architecture required to support complex use-case scenarios for cars, enabling combinations of AP, station, and P2P connections simultaneously.

AIROC™ Wi-Fi & Bluetooth® combos
Superior human-machine interface with PSOC™ automotive multitouch

With the world's broadest portfolio of touchscreen solutions, our patents cover categories from panel construction and self- and mutual capacitance sensing to scanning methods, noise immunity, and finger tracking, spanning every major area of touch sensing innovation. Our continued leadership in the touchscreen space means that we respond to new challenges and market trends with truly innovative solutions.

Automotive touchscreen solutions
Recommended memories for automotive head unit systems

Infineon's parallel NOR flash devices and serial NOR flash devices feature automotive-proven MIRRORBIT™ technology to ensure data reliability and the high endurance required for frequent writes over the product lifespan. In addition, they provide fast system boot times and different densities to scale platforms. Infineon’s NOR flash solutions are AEC-Q100 grade 1 to grade 3 qualified to meet automotive standards for a wide operating temperature range.

Infineon's automotive F-RAM has no write delays and data is immediately non-volatile. F-RAM offers a virtually unlimited endurance of 100 trillion read/write cycles. This enables much more compact and robust designs compared to conventional EEPROM solutions.

Infineon’s HYPERRAM™ 2.0 is a high-speed, low-pin-count, self-refresh dynamic RAM (DRAM) for high-performance embedded systems requiring expansion memory. HYPERRAM™ 2.0 offers HYPERBUS™ and Octal SPI interfaces that draw upon the legacy features of both parallel and serial interface memories while enhancing system performance and ease of design, as well as reducing system costs.

Excellent acoustics via XENSIV™ microphone and MERUS™ audio amplifier

Automotive XENSIV™ MEMS microphones are suited to all applications inside and outside the car, where the best audio performance in harsh automotive environments is required. These automotive microphones enable distortion-free audio capture for all speech-related applications, improving speech intelligibility for voice recognition algorithms. In addition, our sensors perfectly support microphones for ANC (acoustic noise cancellation) with its flat frequency and stable phase response. XENSIV™ MEMS microphones are qualified according to the state-of-the-art automotive quality standard AEC-Q103-003.

XENSIV™ silicon microphones

Our broad IC portfolio covers essential automotive head unit functions

Computing: The TRAVEO™ T2G-B MCU family offers high performance (up to dual Arm® Cortex®-M7, 1500 DMIPs), wide scalability (memory density and package line-up), best-in-class energy efficiency (deep sleep mode: 35 µA, hibernate mode: 5 µA), ASIL-B functional safety and an integrated hardware security module (HSM).

Sensors: The PSOC™ automotive family offers in-cabin touch solutions from one source. Automotive-qualified MEMS microphone sensors provide supreme audio reception in dynamic environments.

Connectivity and communication: Broad Wi-Fi and Bluetooth® portfolio supports various in-cabin wireless connections. CAN, LIN transceivers, and system basis chip (SBC) families connect the head unit to in-vehicle networking.

Power supply: OPTIREG™ PMIC, linear, and switcher devices support reliable power supply. USB-C PD controllers support fast charging (up to 100 W) with best-in-class interoperability and compliance with all kinds of mobile devices.

Storage: Broad automotive-qualified NOR flash, SRAM, and F-RAM portfolio provides safe, secure, and reliable data storage.

Infineon's IC solutions reduce R&D effort and increase competitiveness

Infineon offers a comprehensive portfolio of automotive head unit solutions, empowering you to accelerate time-to-market while maintaining a competitive edge in the rapidly evolving in-car infotainment landscape.

Scalability: Scalable family solutions with wide compatibilities on both hardware and software support designs from low- to high-end systems with less design effort.

Performance: Best-in-class performance of sensing solutions (touchscreens, microphones, etc.), wireless solutions (Wi-Fi and Bluetooth®), and fast-charging solutions (USB-C PD) improves customer experience significantly.

Security: Secured MCU, secured memory, and secured connectivity support secured firmware updates over-the-air (FOTA), and safeguard consumers from cyber-attacks.

Total cost of ownership: Broad portfolio provides a one-stop shop on both commercial and technical level which significantly reduce purchase costs as well as system design effort.

AIROC™ Wi-Fi and Bluetooth® solutions for robust connectivity

Infineon is leading in real simultaneous dual band (RSDB) solutions providing simultaneous operation in both 2.4 GHz and 5 GHz bands, as well as multiple-input multiple-output (MIMO) support. RSDB solutions provide the necessary bandwidth and the software architecture required to support complex use-case scenarios for cars, enabling combinations of AP, station, and P2P connections simultaneously.

AIROC™ Wi-Fi & Bluetooth® combos

Superior human-machine interface with PSOC™ automotive multitouch

With the world's broadest portfolio of touchscreen solutions, our patents cover categories from panel construction and self- and mutual capacitance sensing to scanning methods, noise immunity, and finger tracking, spanning every major area of touch sensing innovation. Our continued leadership in the touchscreen space means that we respond to new challenges and market trends with truly innovative solutions.

Automotive touchscreen solutions

Recommended memories for automotive head unit systems

Infineon's parallel NOR flash devices and serial NOR flash devices feature automotive-proven MIRRORBIT™ technology to ensure data reliability and the high endurance required for frequent writes over the product lifespan. In addition, they provide fast system boot times and different densities to scale platforms. Infineon’s NOR flash solutions are AEC-Q100 grade 1 to grade 3 qualified to meet automotive standards for a wide operating temperature range.

Infineon's automotive F-RAM has no write delays and data is immediately non-volatile. F-RAM offers a virtually unlimited endurance of 100 trillion read/write cycles. This enables much more compact and robust designs compared to conventional EEPROM solutions.

Infineon’s HYPERRAM™ 2.0 is a high-speed, low-pin-count, self-refresh dynamic RAM (DRAM) for high-performance embedded systems requiring expansion memory. HYPERRAM™ 2.0 offers HYPERBUS™ and Octal SPI interfaces that draw upon the legacy features of both parallel and serial interface memories while enhancing system performance and ease of design, as well as reducing system costs.

Excellent acoustics via XENSIV™ microphone and MERUS™ audio amplifier

Automotive XENSIV™ MEMS microphones are suited to all applications inside and outside the car, where the best audio performance in harsh automotive environments is required. These automotive microphones enable distortion-free audio capture for all speech-related applications, improving speech intelligibility for voice recognition algorithms. In addition, our sensors perfectly support microphones for ANC (acoustic noise cancellation) with its flat frequency and stable phase response. XENSIV™ MEMS microphones are qualified according to the state-of-the-art automotive quality standard AEC-Q103-003.

XENSIV™ silicon microphones

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