Data center power solutions

We power AI from grid to core - Enbaling best-in-class AI server rack system efficiency, power density, thermal performance and reliability

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Power solutions for the entire AI data center - From Grid to Core

To meet accelerating AI compute demand, next‑generation processors will need 2–4 kW per GPU, pushing rack power toward 1 MW+ by 2030. Increasing GPU cluster densities demands new power‑architecture designs that boost efficiency, thermal performance, and power‑delivery density while ensuring high reliability. 

Today’s AI racks use 1‑phase PSUs to create a 50 V bus that is distributed to the compute trays, and will support up to 250kW rack power. IBCs and high‑density DC‑DC stages supply <1 V GPU core power, making optimized conversion essential as currents rise into the thousands of amps. Vertical power delivery under the GPU socket is becoming critical to meet density and performance requirements.

Next‑gen racks above 500 kW will move to HVDC sidecar designs using 3‑phase PSUs delivering ±400 V or 800 V distributed to the compute/IT racks. High‑voltage IBCs generate 50 V or 12 V for downstream converters. As systems exceed 1 MW, facilities shift to 800 V HVDC distribution via solid‑state transformers. 

All architectures need robust backup power, energy storage, hot‑swap protection, e‑fuse solutions, and solid‑state circuit breakers.

Infineon powers AI data centers from grid to core with Si, SiC, GaN switches, and ICs such as gate drivers, power stages, sensors, controllers, and MCU.

Download selection guide
Download whitepaper
Single-phase & three-phase server power supply units (PSUs)

Infineon's Si, GaN, and SiC-based solutions enable hybrid PSU solutions that deliver high efficiency, power density, and system cost benefits at each stage of the PSU in single- and three-phase topologies. Typically for the PFC stage, SiC and Si devices are best suited in single-phase PSUs, while SiC and GaN are best suited for three-phase PSUs. For the DC-DC LLC stage, typically SiC or GaN are best suited. 

Our portfolio of power switches along with our gate drivers, digital isolators, auxiliary power and MCUs enable single-phase PSUs up to 12 kW and three-phase PSUs beyond 20 kW+ across a wide range of topologies. Our devices support the increasing power needs of next-generation AI server racks as they transition from 100 kW towards ~1 MW+ per rack. They achieve an impressive benchmark efficiency of ~98%, all while meeting strict hold-up time requirements. Infineon uniquely offers solutions and expertise across all technologies, and a comprehensive selection of packages that ease mechanical design and enable top-side cooling to manage PSU thermals and reach >100W/in3 power density. 

A variety of reference designs are available to shorten PSU development effort and time-to-market.

3 KW-12 KW PSU solutions
Learn more about server power supply units
Server battery backup units (BBUs)

Due to the length and complexity of modern data center tasks, safeguarding uninterrupted operation is a crucial task.

BBUs are critical for providing a reliable source of power in the event of an outage or grid failure, ensuring continuous operation of AI workloads. Infineon's battery backup unit solutions leverage advanced converter architectures to minimize size and maximize output power capability and efficiency. They are based on a partial power concept and can be customized depending on the battery configuration, enabling efficient, reliable, and scalable power conversion and ensuring uninterrupted operation of these critical facilities. The partial power concept achieves 4-times higher power density and extending power to 12kW+ and beyond, which is not possible with today's state-of-the-art solutions.

4 KW-12 KW BBU solutions
Learn more about battery backup units
50V (MVDC) & +/-400V or 800V (HVDC) Intermediate Bus Converters

The intermediate bus converter (IBC) transforms high-voltage server PSU output into lower, manageable voltage for AI accelerators. Limited space on accelerator cards and high power demands require exceptional power density, efficiency, and peak-power capability. Wide load dynamics, with peaks nearly double the average power, drive rapid innovation in IBC design.

Our portfolio supports a broad range of IBC topologies and conversion ratios - both regulated and unregulated DC-DC converters - and have been successfully integrated into 48 V IBC solutions on leading AI card platforms. We also offer high-voltage IBC reference designs, leveraging high- and medium-voltage CoolGaNTM switches, EiceDRIVERTM gate driver ICs and PSOCTM micocontrollers. The higher conversion ratios of the IBC, together with OptiMOS™ high-density dual & quad-phase power modules, are key enablers of high density vertical power delivery (VPD) and reduced TCO within an AI data center. 

Learn more about intermediate bus converter (IBC)
Low Voltage DC-DC Processor Power

Converting electrical power flow from the IBC down to the very low voltages used by the processor core requires dedicated components and systems. These  functions are needed for traditional data centers as well as those used in AI server applications. Infineon features solutions for CPUs, FPGAs, top of rack switch SoCs, AI accelerator cards / GPUs, and smart network interface cards (Smart NIC). Our distinct product offering includes power and control solutions such as dual- and quad-phase power modules, digital power controllers, integrated power stages, and analog and digital integrated Point-of-Loads (PoLs). In order to meet the demanding requirements of the latest AI server generations, these solutions ensure best-in-class efficiency, power density, and thermal performance.

In addition, due to the rapidly rising power demands and energy cost of AI GPU (Graphic Processor Unit) platforms, Infineon Introduces the third generation of DC-DC power modules: TDM2454xx OptiMOS™ quad-phase power modules 280 A, enabling true vertical power delivery (VPD) and offering a best-in-class power density of 2.0A/mm2 in a compact 10x9x5 mm package.

Power Path Protection

Infineon's digital hot-swap controllers provide a wide range of protection and monitoring features including digital SOA control, which is essential in safeguarding against inrush current and fault conditions in high-availability systems. These devices are optimized for AI servers to allow safe insertion and removal of server blades without shutting down the systems, minimizing downtime and maintaining continuous operation of AI workloads. High-precision AFE, such as current and voltage ADCs and PMBus for telemetry, enables accurate monitoring and reporting of the power and energy usage in a typical server rack system. This allows OEMs/operators to remotely monitor each rack individually for a more efficient system operation, thus resulting in energy saving and minimized system downtime. Infineon’s XDP™ digital controllers alongside with OptiMOS™ LinearFETs with low RDS(on) and strong SOA capability, provide scalable and robust protection.

Our portfolio will soon expand to include eFuses, which integrate Infineon MOSFETs and current and temperature sensors into one package to reduce design time and BOM cost. This will result in simpler designs and smaller footprints.

Learn more about power path protection

Power solutions for the entire AI data center - From Grid to Core

To meet accelerating AI compute demand, next‑generation processors will need 2–4 kW per GPU, pushing rack power toward 1 MW+ by 2030. Increasing GPU cluster densities demands new power‑architecture designs that boost efficiency, thermal performance, and power‑delivery density while ensuring high reliability. 

Today’s AI racks use 1‑phase PSUs to create a 50 V bus that is distributed to the compute trays, and will support up to 250kW rack power. IBCs and high‑density DC‑DC stages supply <1 V GPU core power, making optimized conversion essential as currents rise into the thousands of amps. Vertical power delivery under the GPU socket is becoming critical to meet density and performance requirements.

Next‑gen racks above 500 kW will move to HVDC sidecar designs using 3‑phase PSUs delivering ±400 V or 800 V distributed to the compute/IT racks. High‑voltage IBCs generate 50 V or 12 V for downstream converters. As systems exceed 1 MW, facilities shift to 800 V HVDC distribution via solid‑state transformers. 

All architectures need robust backup power, energy storage, hot‑swap protection, e‑fuse solutions, and solid‑state circuit breakers.

Infineon powers AI data centers from grid to core with Si, SiC, GaN switches, and ICs such as gate drivers, power stages, sensors, controllers, and MCU.

Download selection guide
Download whitepaper

Single-phase & three-phase server power supply units (PSUs)

Infineon's Si, GaN, and SiC-based solutions enable hybrid PSU solutions that deliver high efficiency, power density, and system cost benefits at each stage of the PSU in single- and three-phase topologies. Typically for the PFC stage, SiC and Si devices are best suited in single-phase PSUs, while SiC and GaN are best suited for three-phase PSUs. For the DC-DC LLC stage, typically SiC or GaN are best suited. 

Our portfolio of power switches along with our gate drivers, digital isolators, auxiliary power and MCUs enable single-phase PSUs up to 12 kW and three-phase PSUs beyond 20 kW+ across a wide range of topologies. Our devices support the increasing power needs of next-generation AI server racks as they transition from 100 kW towards ~1 MW+ per rack. They achieve an impressive benchmark efficiency of ~98%, all while meeting strict hold-up time requirements. Infineon uniquely offers solutions and expertise across all technologies, and a comprehensive selection of packages that ease mechanical design and enable top-side cooling to manage PSU thermals and reach >100W/in3 power density. 

A variety of reference designs are available to shorten PSU development effort and time-to-market.

3 KW-12 KW PSU solutions
Learn more about server power supply units

Server battery backup units (BBUs)

Due to the length and complexity of modern data center tasks, safeguarding uninterrupted operation is a crucial task.

BBUs are critical for providing a reliable source of power in the event of an outage or grid failure, ensuring continuous operation of AI workloads. Infineon's battery backup unit solutions leverage advanced converter architectures to minimize size and maximize output power capability and efficiency. They are based on a partial power concept and can be customized depending on the battery configuration, enabling efficient, reliable, and scalable power conversion and ensuring uninterrupted operation of these critical facilities. The partial power concept achieves 4-times higher power density and extending power to 12kW+ and beyond, which is not possible with today's state-of-the-art solutions.

4 KW-12 KW BBU solutions
Learn more about battery backup units

50V (MVDC) & +/-400V or 800V (HVDC) Intermediate Bus Converters

The intermediate bus converter (IBC) transforms high-voltage server PSU output into lower, manageable voltage for AI accelerators. Limited space on accelerator cards and high power demands require exceptional power density, efficiency, and peak-power capability. Wide load dynamics, with peaks nearly double the average power, drive rapid innovation in IBC design.

Our portfolio supports a broad range of IBC topologies and conversion ratios - both regulated and unregulated DC-DC converters - and have been successfully integrated into 48 V IBC solutions on leading AI card platforms. We also offer high-voltage IBC reference designs, leveraging high- and medium-voltage CoolGaNTM switches, EiceDRIVERTM gate driver ICs and PSOCTM micocontrollers. The higher conversion ratios of the IBC, together with OptiMOS™ high-density dual & quad-phase power modules, are key enablers of high density vertical power delivery (VPD) and reduced TCO within an AI data center. 

Learn more about intermediate bus converter (IBC)

Low Voltage DC-DC Processor Power

Converting electrical power flow from the IBC down to the very low voltages used by the processor core requires dedicated components and systems. These  functions are needed for traditional data centers as well as those used in AI server applications. Infineon features solutions for CPUs, FPGAs, top of rack switch SoCs, AI accelerator cards / GPUs, and smart network interface cards (Smart NIC). Our distinct product offering includes power and control solutions such as dual- and quad-phase power modules, digital power controllers, integrated power stages, and analog and digital integrated Point-of-Loads (PoLs). In order to meet the demanding requirements of the latest AI server generations, these solutions ensure best-in-class efficiency, power density, and thermal performance.

In addition, due to the rapidly rising power demands and energy cost of AI GPU (Graphic Processor Unit) platforms, Infineon Introduces the third generation of DC-DC power modules: TDM2454xx OptiMOS™ quad-phase power modules 280 A, enabling true vertical power delivery (VPD) and offering a best-in-class power density of 2.0A/mm2 in a compact 10x9x5 mm package.

Power Path Protection

Infineon's digital hot-swap controllers provide a wide range of protection and monitoring features including digital SOA control, which is essential in safeguarding against inrush current and fault conditions in high-availability systems. These devices are optimized for AI servers to allow safe insertion and removal of server blades without shutting down the systems, minimizing downtime and maintaining continuous operation of AI workloads. High-precision AFE, such as current and voltage ADCs and PMBus for telemetry, enables accurate monitoring and reporting of the power and energy usage in a typical server rack system. This allows OEMs/operators to remotely monitor each rack individually for a more efficient system operation, thus resulting in energy saving and minimized system downtime. Infineon’s XDP™ digital controllers alongside with OptiMOS™ LinearFETs with low RDS(on) and strong SOA capability, provide scalable and robust protection.

Our portfolio will soon expand to include eFuses, which integrate Infineon MOSFETs and current and temperature sensors into one package to reduce design time and BOM cost. This will result in simpler designs and smaller footprints.

Learn more about power path protection

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