Failure analysis network

Failure analysis (FA) finds the root cause of any malfunction of our products and helps to improve reliability and yield throughout the entire product lifecycle.

A global network of Failure Analysis laboratories and experts supports analysis requests world wide. This network tailors the analysis support to your individual case requirements – no matter to which location the request was submitted.

Failure analysis network

Failure analysis (FA) finds the root cause of any malfunction of our products and helps to improve reliability and yield throughout the entire product lifecycle.

A global network of Failure Analysis laboratories and experts supports analysis requests world wide. This network tailors the analysis support to your individual case requirements – no matter to which location the request was submitted.

Failure analysis network

Failure analysis (FA) finds the root cause of any malfunction of our products and helps to improve reliability and yield throughout the entire product lifecycle.

A global network of Failure Analysis laboratories and experts supports analysis requests world wide. This network tailors the analysis support to your individual case requirements – no matter to which location the request was submitted.

Failure analysis network

Starting with the first project idea and prototype, Infineons‘s global FA organization accompanies a product throughout its entire lifecycle. Thanks to early engagement in product development, the FA laboratories are well prepared with a variety of cutting-edge FA methods and tools, as well as comprehensive knowledge on the product properties and history.

Failure analysis network

Starting with the first project idea and prototype, Infineons‘s global FA organization accompanies a product throughout its entire lifecycle. Thanks to early engagement in product development, the FA laboratories are well prepared with a variety of cutting-edge FA methods and tools, as well as comprehensive knowledge on the product properties and history.

Failure analysis network

Starting with the first project idea and prototype, Infineons‘s global FA organization accompanies a product throughout its entire lifecycle. Thanks to early engagement in product development, the FA laboratories are well prepared with a variety of cutting-edge FA methods and tools, as well as comprehensive knowledge on the product properties and history.

Analysis flow

The analysis flow is tailored to the individual case: Starting with electrical verification, non-destructive analysis techniques involving optical and X-ray inspection are combined with detailed failure localizationpreparation and visualization. To pin-point and understand the failure mechanism, sophisticated methods and tools enable analysis down to the nanometer scale, employing transistor-level nanoprobing or even atomic-resolution imaging with Transmission Electron Microscopy (TEM). This flow is optimized by KI-based data analysis and continuous method development for fast and high quality analysis results.

Analysis flow

The analysis flow is tailored to the individual case: Starting with electrical verification, non-destructive analysis techniques involving optical and X-ray inspection are combined with detailed failure localizationpreparation and visualization. To pin-point and understand the failure mechanism, sophisticated methods and tools enable analysis down to the nanometer scale, employing transistor-level nanoprobing or even atomic-resolution imaging with Transmission Electron Microscopy (TEM). This flow is optimized by KI-based data analysis and continuous method development for fast and high quality analysis results.

Analysis flow

The analysis flow is tailored to the individual case: Starting with electrical verification, non-destructive analysis techniques involving optical and X-ray inspection are combined with detailed failure localizationpreparation and visualization. To pin-point and understand the failure mechanism, sophisticated methods and tools enable analysis down to the nanometer scale, employing transistor-level nanoprobing or even atomic-resolution imaging with Transmission Electron Microscopy (TEM). This flow is optimized by KI-based data analysis and continuous method development for fast and high quality analysis results.