Integrated class D audio amplifier Ics

MERUS™ class D audio amplifier ICs, multi-chip modules, and discrete MOSFET/HEMT driver ICs

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Overview

Infineon’s multilevel class D audio amplifier IC circuit technology has made it possible to improve power consumption while reducing electromagnetic interference and out-of-band noise. Manufacturing costs can also be reduced by eliminating or minimizing the use of filters, helping to save design space. With the class D audio amplifier ICs, Infineon leads in power efficiency and power density. Cooler, smaller, and lighter class D audio amplifiers for great sounding products.

Key Features

  • High power efficiency
  • Integration for small and light solutions
  • High quality due to robustness and flexibility
  • Saved design space

Products

About

Offering exceptional power efficiency and audio quality, Infineon’s integrated class D amplifier product family provides compact and highly efficient single- and dual-channel analog and digital I2S packages with high noise-immunity for low-power audio applications.

With the revolutionary multi-level amplifier technology, Infineon is leading the industry in terms of power efficiency. The monolithic, fully integrated class D amplifier's multi-level ICs allow filter-less, heatsink-free implementation and give designers enhanced flexibility to optimize audio systems for performance, size, and cost to meet critical design objectives in both today’s and tomorrow’s audio applications.

The integrated class D audio amplifier MCM family of devices integrates PWM controllers and digital audio power MOSFETs in a single package to offer a highly power efficient, compact solution that reduces component count, eliminates the need for heatsinks, and shrinks PCB size by up to 70 percent.

Infineon’s portfolio of integrated class D audio amplifier solutions includes both analog and digital audio input types and are available with 90 W, 100 W, 130 W, 160 W, and 200 W output power for a variety of audio applications including portable Bluetooth® speakers, home theatre systems, and professional audio systems. Our ultra-compact and highly configurable designs offer best-in-class audio performance with low interference and low power losses.

Integrated class D audio amplifier solutions enable customers to maximize audio performance and power efficiency while providing the highest degree of design freedom for innovative industrial product designs. The integrated audio ICs are available in compact and thermally efficient PQFN packages which eliminate the need for heatsinks.

Offering exceptional power efficiency and audio quality, Infineon’s integrated class D amplifier product family provides compact and highly efficient single- and dual-channel analog and digital I2S packages with high noise-immunity for low-power audio applications.

With the revolutionary multi-level amplifier technology, Infineon is leading the industry in terms of power efficiency. The monolithic, fully integrated class D amplifier's multi-level ICs allow filter-less, heatsink-free implementation and give designers enhanced flexibility to optimize audio systems for performance, size, and cost to meet critical design objectives in both today’s and tomorrow’s audio applications.

The integrated class D audio amplifier MCM family of devices integrates PWM controllers and digital audio power MOSFETs in a single package to offer a highly power efficient, compact solution that reduces component count, eliminates the need for heatsinks, and shrinks PCB size by up to 70 percent.

Infineon’s portfolio of integrated class D audio amplifier solutions includes both analog and digital audio input types and are available with 90 W, 100 W, 130 W, 160 W, and 200 W output power for a variety of audio applications including portable Bluetooth® speakers, home theatre systems, and professional audio systems. Our ultra-compact and highly configurable designs offer best-in-class audio performance with low interference and low power losses.

Integrated class D audio amplifier solutions enable customers to maximize audio performance and power efficiency while providing the highest degree of design freedom for innovative industrial product designs. The integrated audio ICs are available in compact and thermally efficient PQFN packages which eliminate the need for heatsinks.

Documents

Design resources

Developer community

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