With increasing number of semiconductor components in our daily live products, the quality and reliability of each individual part becomes more and more important to ensure product reliability over lifetime.

Qualification

We ensure high-quality products by adhering to a dedicated qualification process that verifies functionality, reliability, and manufacturability.

  • Customer needs and market trends are considered early in the process, and reliability testing is conducted throughout the whole development to ensure built-in quality.
  • The process includes thorough qualification of wafer and package technology, testing of related software, along with reliability investigations regarding potential failure mechanisms.
  • Product qualification proves the form, fit, function and reliability of the final product, including chip, package, chip / package interaction, and design. Specific requirements of its later operating environment are taken into account, and related software and firmware is included in the process.
  • We are following our commitments regarding the required quality and international standards such as AEC, JEDEC, MIL, and IEC.
  • To ensure consistent quality after product release, our products are continuously monitored during production.
Qualification PIC
Qualification PIC
Qualification PIC

We ensure the quality along the product lifecycle. Qualification is an essential part of our development processes, where all tasks are aligned with the relevant development milestones.

Qualification PIC
Qualification PIC
Qualification PIC

Qualification reports are available on the product pages at infineon.com.

Reliability

Reliability means the probability of an item performing a required function under defined use conditions for a specified time interval. This is demonstrated under accelerated stress conditions using extrapolation with common acceleration models (e.g., Arrhenius, Eyring, Coffin-Manson, and Peck). Infineon applies a qualification and validation approach based on two key components:

  • Mission profile
    • Knowledge of the conditions of use
  • Physics of failure
    • Knowledge of the failure mechanisms and failure modes and of the possible interactions between different failure mechanisms
    • Knowledge of acceleration models for the failure mechanisms to define and assess accelerated tests

In wafer technology development, especially for ICs, highly sophisticated test chip designs provide statistics that can indicate whether or not the mission profile is fulfilled.

With our reliability and qualification department we have a strong center of competence for reliability - With best in class reliability methods, leading edge qualification processes/services, and a worldwide scalable organizational set up.

Stress tests are performed in independent worldwide connected reliability labs. The reliability organization ensures with standard based and failure mode specific test methods the qualification and evaluation of technologies and products as well as independent monitoring methods ​just in time and by excellent execution quality. With standardized equipment and coordinated concepts, the labs are highly flexible and have a high resilience. 

While the time-to-market requirements become tighter, the quality requirements increase beyond standards. We shape our qualifications accordingly, speeding-up the timelines despite the natural limitations by physics of failure and acceleration methods.