High-reliability power conversion and management

DLA-qualified and engineered for performance in extreme environments

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About

High-reliability manufacturing expertise

Infineon’s experience with controlled manufacturing process and flow stems from decades of compliance with MIL-STD requirements for our IR HiRel products used in aerospace, defense, and other high-reliability applications. Supply continuity is ensured with die/wafer bank inventory as required in typical high-reliability system lifespans.

High-reliability quality commitment

Infineon has well-established quality management systems with focus on production stability, continued improvement, and driving to zero defects. Meeting stringent customer requirements for design control and development changes, part identification and traceability, risk management, and supply continuity derive from our IR HiRel heritage established in serving aerospace and defense manufacturers. 

HiRel COTS+ extended product qualification and up-screening services

Working with IR HiRel provides access to Infineon’s broad portfolio of power semiconductor solutions which can be up-screened according to customer requirements such as: 

  • 100% burn-in testing to detect early "infant mortalities" failure 
  • Wearout
  • 100% wafer-level probe
  • Extended operating temperature qualification, including over MIL temperature range (-55°C to 125°C)
  • Assembly of up-screened silicon in plastic packages
  • Solderability test in 5-year periods (extended shelf life) combined with vacuum sealed packaging
  • JANP up-screening of existing products in plastic package form

Through IR HiRel, extension of product life or support services (such as die/wafer bank) are also available for Infineon COTS and automotive power components that may be used in high-reliability electronic designs in space, avionics, defense, medical, and more. This ensures supply longevity, avoiding obsolescence-induced support issues and requalification costs, which can be significant in high-reliability applications.

High reliability packaging information

Learn more about Infineon’s rad hard and HiRel MOSFET portfolios’ package details, including package outline drawings, weights and more.  

Learn more about HiRel's packaging information

High-reliability manufacturing expertise

Infineon’s experience with controlled manufacturing process and flow stems from decades of compliance with MIL-STD requirements for our IR HiRel products used in aerospace, defense, and other high-reliability applications. Supply continuity is ensured with die/wafer bank inventory as required in typical high-reliability system lifespans.

High-reliability quality commitment

Infineon has well-established quality management systems with focus on production stability, continued improvement, and driving to zero defects. Meeting stringent customer requirements for design control and development changes, part identification and traceability, risk management, and supply continuity derive from our IR HiRel heritage established in serving aerospace and defense manufacturers. 

HiRel COTS+ extended product qualification and up-screening services

Working with IR HiRel provides access to Infineon’s broad portfolio of power semiconductor solutions which can be up-screened according to customer requirements such as: 

  • 100% burn-in testing to detect early "infant mortalities" failure 
  • Wearout
  • 100% wafer-level probe
  • Extended operating temperature qualification, including over MIL temperature range (-55°C to 125°C)
  • Assembly of up-screened silicon in plastic packages
  • Solderability test in 5-year periods (extended shelf life) combined with vacuum sealed packaging
  • JANP up-screening of existing products in plastic package form

Through IR HiRel, extension of product life or support services (such as die/wafer bank) are also available for Infineon COTS and automotive power components that may be used in high-reliability electronic designs in space, avionics, defense, medical, and more. This ensures supply longevity, avoiding obsolescence-induced support issues and requalification costs, which can be significant in high-reliability applications.

High reliability packaging information

Learn more about Infineon’s rad hard and HiRel MOSFET portfolios’ package details, including package outline drawings, weights and more.  

Learn more about HiRel's packaging information

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