Please note that this is an end of life product. Explore the product family for available alternatives. Please note that this is an end of life product. Explore the product family for available alternatives.
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CYBLE-333074-02
END OF LIFE
discontinued
RoHS Compliant

CYBLE-333074-02

END OF LIFE
Datasheet
package
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software
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CYBLE-333074-02
CYBLE-333074-02
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Datasheet


Product details

  • ADC (#, Max. Resolution @ Sample Rate)
    SD(1,12 bit ENoB (audio), 10-bit ENoB (DC), 12MHz Clock)
  • Base Silicon
    CYW20835
  • Bluetooth Classic
    No
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    N/A
  • Bluetooth EDR 2Mbps TX POWER
    N/A
  • Bluetooth LE Data rate
    2 MByte/s
  • Bluetooth LE RX SENSITIVITY
    - 94.5 dBm
  • Bluetooth LE TX POWER
    12 dBm
  • Bluetooth LE
    Yes
  • CapSense
    No
  • CPU Core
    96MHz
  • Extended Range
    No
  • Family
    AIROC™ Bluetooth Modules
  • Flash
    512 KByte
  • GPIOs
    24
  • I2C
    1
  • Launch Date
    31-12-2019
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Main CPU Core
    Arm® Cortex®- M4
  • Operating Temperature range
    -30 °C to 85 °C
  • Operational Amplifier
    No
  • Pads
    43
  • PDM
    1
  • Planned to be available until at least
    31-12-2034
  • PWM
    6
  • ROM
    2MB
  • Secondary CPU Core
    None
  • Serial Communication Blocks
    0
  • Size (X mm x Y mm x Z mm)
    13.31 x 21.89 x 1.95 mm
  • SPI
    1
  • SRAM
    384 KByte
  • Type of Antenna
    External - RF pad
  • UART
    2
  • V range
    2.5 V to 3.6 V

OPN
CYBLE-333074-02
Product Status discontinued
Infineon Package
LG-MLGA-42
Package Name MODULE-42 (002-28053)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Country of Assembly (CoA)
CN
Country of Diffusion (CoD)
DE
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Product Status discontinued
Infineon Package
LG-MLGA-42
Package Name MODULE-42 (002-28053)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
CN
Country of Diffusion (CoD)
DE
View product family
Infineon’s AIROC™ CYBLE-333074-02 is a fully certified Bluetooth® LE module based on Infineon’s CYW20835. This embedded module includes a royalty-free Bluetooth® stack and is available in 13.31 x 21.89 x 1.95 mm SMT form-factor. Infineon’s AIROC™ CYBLE-333074-02 module complies with Bluetooth® Core 5.2 and has gone through qualification with required testing path with Declaration ID D056777 and QDID 176091.

Features

  • FCC, ISED, MIC, and CE certified
  • Onboard crystal oscillator
  • Passive components
  • Flash memory
  • u.FL connector for external antenna
  • CYW20835 system on chip

Benefits

  • Support fast time-to-market
  • Support a wide spectrum of applications
  • Low power
  • Low cost

Applications

Diagrams

CYBLE-333074-02 Block Diagram
CYBLE-333074-02 Block Diagram
CYBLE-333074-02 Block Diagram CYBLE-333074-02 Block Diagram CYBLE-333074-02 Block Diagram
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