MODULE-42 (002-28053)

LG-MLGA-42-800

Package details

  • Package Material
    LG
  • Package Family
    LG-MLGA
  • Terminals
    42
  • Variant
    800
  • Exposed Paddle
    No
  • Body Length (mm)
    13.3
  • Body Width (mm)
    22.4
  • Min. Terminal Pitch (mm)
    0.9
Infineon module land grid array (MLGA) packages are offered as different variants. MLGA type components are built on an advanced laminate substrate with multiple layers of circuitry. The system on module (SOM) provides a specific function by system integration on board-level. The concerted devices allow for an efficient circuitry, a compact module design and a cost-effective application. Infineon modules can consist of multiple micro-electro-mechanical system (MEMS), micro-controllers (MC) as well as active and passive devices. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Special gripping might be needed for handling the modules during pick&place. Typical products are CO<sub>2</sub> sensors, Bluetooth® modules, and integrated power stages.

Image Gallery

LG-MLGA-42-800_Package Outline
LG-MLGA-42-800_Package Outline
LG-MLGA-42-800_Package Outline LG-MLGA-42-800_Package Outline LG-MLGA-42-800_Package Outline
LG-MLGA-42-800_Footprint Drawing LG-MLGA-42-800_Footprint Drawing LG-MLGA-42-800_Footprint Drawing
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Documents and drawings

Documents and drawings