Active and preferred
RoHS Compliant
Lead-free

5962F2122201PXE

Infineon offers the space industry’s first DLAM QML-P qualified, radiation hardened by design, quad SPI (QSPI) NOR Flash.
Data Sheet
package

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5962F2122201PXE
5962F2122201PXE
Data Sheet

Product details

  • Density
    512 MBit
  • Device weight
    890.24 mg
  • Family
    NOR
  • Frequency
    133 MHz
  • Interfaces
    QSPI
  • Operating Temperature
    -55 °C to 125 °C
  • Operating Voltage
    2.97 V to 3.63 V
  • Organization (X x Y)
    x4
  • Planned to be available until at least
    2035
  • Qualification
    Military
Recommended
OPN
5962F2122201PXEXYSA1
Product Status active and preferred
Infineon Package
PG-TQFP-100
Package Name TQFP-100 (51-85050)
Packing Size 1
Packing Type CONTAINER
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-TQFP-100
Package Name TQFP-100 (51-85050)
Packing Size 1
Packing Type CONTAINER
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Our 512 Mbit rad hard NOR flash, is the first in its family from Infineon, offering the highest performance, density, radiation, and single event effects (SEE) performance combination for space FPGA boot code and configuration image storage solutions for satellites.

Features

  • 512Mb density, QSPI at 125MHz
  • 100k cycle write/infinite read endurance
  • 10-year data retention @ 125ºC
  • 1.8 V / 3.3 V I/O support
  • 100-pin TQFP package
  • DLAM QML qualified SMD 5962-21222
  • Radiation performance
  • TID > 300krad
  • SEU IMMUNE
  • SEL > 80 LET MeV.cm2/mg [LET]
  • SEFI 4.75e-5 err/dev.day

Benefits

  • Superior radiation performance
  • 512Mbit density, 133MHz QSPI interface
  • TQFP plastic package option
  • Lower weight for SWaP-C benefits
  • DLAM QML-P certification
  • Highest reliability standard (QML-P)

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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