NEW
Active and preferred
RoHS Compliant
Lead-free

TLE493D-P3B6 A2

NEW
XENSIV™ - TLE493D-P3B6 A2 preconfigured with a specific I2C address to enable operation in bus mode
Data Sheet
package

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TLE493D-P3B6 A2
TLE493D-P3B6 A2
Data Sheet

Product details

  • Additional Information
    improved accuracy
  • Classification
    ISO 26262-compliant, AEC-Q100
  • Interfaces
    I²C
  • Currently planned availability until at least
    2038
  • Pre-Programed Init Address
    yes
  • Target Application
    Automotive
  • Wake-Up Functionality
    yes
Recommended
OPN
TLE493DP3B6A2HTSA1
Product Status active and preferred
Infineon Package
PG-TSOP6-6
Package Name N/A
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-TSOP6-6
Package Name -
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
XENSIV™ TLE493D-P3B6 is a magnetic 3D Hall sensor from Infineon’s latest generation. Part of the TLE493D-x3xx family, it offers a wider supply voltage range, full ISO26262 compliance, and improved drift values. TLE493D-P3B6 A2 is preconfigured with a specific I2C address to enable operation in bus mode. This capability enables up to 4 sensors to share the same bus. All features and target applications are identical to TLE493D-P3B6 A0.

Features

  • Reference for EMC and board size
  • Optimized BOM and PCB size
  • Power capability up to 200W
  • SWD port for debug connection
  • LIN, Panel and monitoring connector
  • High-temperature FR4 PCB, 2-layer Copper
  • Small 90x55 mm PCB size
  • Extensive documentation including:
  • layout files
  • design guide
  • schematics
  • getting started guide
  • hardware design guideline
  • EMC report

Benefits

  • Reduced time to market
  • Minimal BOM and reduced PCB size
  • State of the art components
  • Scalability of the device

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }