Active and preferred
RoHS Compliant

SLC37GDAXXX

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SLC37GDAXXX
SLC37GDAXXX

Product details

  • Additional Information
    Please note that xxx in product names stands for NVM size
  • Ambient Temperature
    -25 °C to 85 °C
  • Applications
    government identification, national eID, ePassport, eHealth card / eSocial card, eDriver’s license, eVisa, eResidence permit, eTachograph, eVehicle registration card / eCar registration, eSignature
  • Asymmetric Cryptography
    ECC up to 521-bit, RSA up to 4096-bit
  • Certifications
    CC EAL6+ high targeted, EMVCo targeted
  • CPU
    32-bit Arm® SecurCore® SC300
  • Delivery Forms
    contactless module, dual-interface module, sawn wafer
  • Interfaces
    NRG™ (ISO/IEC 14443-3 type A with CRYPTO1), ISO 7816, ISO 14443 A/B, ISO 18092 passive mode
  • Leading Technologies
    VHBR, SOLID FLASH™
  • NVM
    448 kByte to 512 kByte
  • Product Description
    contactless security cryptocontroller with dual-interface
  • RAM
    16 kByte
  • Symmetric Cryptography
    DES, 3DES, AES up to 256-bit
Recommended
OPN
SLC37GDA512AACX1SA6 SLC37GDA512A8MCS8XHSA6
Product Status active and preferred active and preferred active and preferred
Infineon Package -- -- P-MCS8-2
Package Name N/A N/A N/A
Packing Size N/A 1 1
Packing Type N/A WAFER SAWN REEL FOR CHIP CARD
Moisture Level N/A N/A N/A
Moisture Packing N/A DRY NON DRY
Lead-free No Yes Yes
Halogen Free Yes Yes Yes
RoHS Compliant Yes Yes Yes
Infineon stock last updated:

Product Status
Active
Infineon Package --
Package Name -
Packing Size 0
Packing Type
Moisture Level -
Moisture Packing
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package --
Package Name -
Packing Size 1
Packing Type WAFER SAWN
Moisture Level -
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package P-MCS8-2
Package Name -
Packing Size 1
Packing Type REEL FOR CHIP CARD
Moisture Level -
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

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