Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
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END OF LIFE
discontinued
RoHS Compliant
Lead-free

IRFI4019H-117P

END OF LIFE
150V Dual N-Channel Digital Audio StrongIRFET™ Power MOSFET in a TO-220 FullPak package

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Product details

  • Budgetary Price €/1k
    0.96
  • ID (@25°C) max
    8.7 A
  • Operating Temperature
    -55 °C to 150 °C
  • Package
    TO-220 FullPAK
  • Polarity
    N+N
  • Ptot (@ TA=25°C) max
    18 W
  • Qgd (typ)
    3.9 nC
  • QG (typ @10V)
    13 nC
  • RDS (on) (@10V) max
    95 mΩ
  • RthJA max
    65 K/W
  • Tj max
    150 °C
  • VDS max
    150 V
  • VGS(th)
    3.95 V
  • VGS max
    20 V
OPN
IRFI4019H-117P IRFI4019H-117PXKMA1
Product Status discontinued discontinued
Infineon Package
Package Name TO-220 FullPAK FullPAK-220
Packing Size 1000 1000
Packing Type TUBE TUBE
Moisture Level N/A NA
Moisture Packing NON DRY NON DRY
Lead-free Yes Yes
Halogen Free Yes Yes
RoHS Compliant Yes Yes
Infineon stock last updated:

Product Status discontinued
Infineon Package
Package Name TO-220 FullPAK
Packing Size 1000
Packing Type TUBE
Moisture Level -
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status discontinued
Infineon Package
Package Name FullPAK-220
Packing Size 1000
Packing Type TUBE
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The StrongIRFET™ power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters.

Features

  • RoHS Compliant
  • Low RDS(on)
  • Dual N-Channel MOSFET
  • Integrated Half Bridge package
  • Low Qrr
Low Qg and Qsw
  • Isolated package
  • Benefits

    • Environmentally friendly
    • High power density
    • Integrated design
    • Board savings
    • Low EMI
    • Enables better THD and high efficiency
    • No need for insulating hardware

    Applications

    Documents

    Design resources

    Developer community

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