Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
END OF LIFE
discontinued
RoHS Compliant
Lead-free

IRF9383M

END OF LIFE
-30V Single P-Channel StrongIRFET™ Power MOSFET in a DirectFET™ MX package
Data Sheet
package

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IRF9383M
IRF9383M
Data Sheet

Product details

  • Budgetary Price €/1k
    0.8
  • ID (@25°C) max
    -160 A
  • Moisture Sensitivity Level
    1
  • Package
    DirectFET(M)
  • Polarity
    P
  • Ptot (@ TA=25°C) max
    2.1 W
  • Ptot max
    113 W
  • Qgd
    29 nC
  • QG (typ @4.5V)
    67 nC
  • RDS (on) (@10V) max
    2.9 mΩ
  • RDS (on) (@4.5V) max
    4.8 mΩ
  • RthJC max
    1.1 K/W
  • Tj max
    150 °C
  • VDS max
    -30 V
  • VGS(th)
    -1.8 V
  • VGS max
    20 V
OPN
IRF9383MTRPBF
Product Status discontinued
Infineon Package
MG-WDSON-5
Package Name DirectFET MX
Packing Size 4800
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status discontinued
Infineon Package
MG-WDSON-5
Package Name DirectFET MX
Packing Size 4800
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The StrongIRFET™ power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters.

Features

  • Optimized for broadest availability from distribution partners
  • Product qualification according to JEDEC standard
  • High-current rating
  • Dual-side cooling capability
  • Low package height of 0.7mm
  • Low parasitic (1-2 nH) inductance package
  • 100% lead-free (No RoHS exemption)

Benefits

  • Wide availability from distribution partners
  • Industry standard qualification level
  • High current carrying capability
  • Optimum thermal performance
  • Compact form factor
  • High efficiency
  • Environmentally friendly

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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