DirectFET (M)

MG-WDSON-5-909

Download 3D model

Package details

  • Package Material
    MG
  • Package Family
    MG-WDSON
  • Terminals
    5
  • Variant
    909
  • Exposed Paddle
    No
  • Body Length (mm)
    6.35
  • Body Width (mm)
    5.05
  • Min. Terminal Pitch (mm)
    0.99
Infineon metal can packages for power devices are offered as different variants. They are designated as metal green very very thin dual small outline nonleaded (WDSON) packages. Alternative designations using DirectFET™ may also include the various can sizes and device outlines that are classified into small (S), medium (M), and large (L). All devices come with a metal can where the die is being attached to. That facilitates dual-sided cooling. The ‘plus’ variants use thinner dies to improve electrical performance and efficiency. The pre-soldered bump-shaped terminations allow for high-throughput board mounting using surface mount technology (SMT). Both the die pads as well as the can feature solderable areas that level on the same plane. Typical products are automotive MOSFET, N-channel and P-channel transistors.

Image Gallery

SPO MG-WDSON-5-909
SPO MG-WDSON-5-909
SPO MG-WDSON-5-909 SPO MG-WDSON-5-909 SPO MG-WDSON-5-909
FPD MG-WDSON-5-909 FPD MG-WDSON-5-909 FPD MG-WDSON-5-909
×
modalImg

Documents and drawings

Documents and drawings