Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
END OF LIFE
discontinued
RoHS Compliant

IRF6674

END OF LIFE
60V Single N-Channel StrongIRFET™ Power MOSFET in a DirectFET™ MX package
Data Sheet
package

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IRF6674
IRF6674
Data Sheet

Product details

  • Budgetary Price €/1k
    0.69
  • ID (@25°C) max
    67 A
  • Micro-stencil
    IRF66MZ-25
  • Moisture Sensitivity Level
    1
  • Mounting
    SMD
  • Operating Temperature
    -40 °C to 150 °C
  • Package
    DirectFET (M)
  • Polarity
    N
  • Ptot (@ TA=25°C) max
    3.6 W
  • Ptot max
    89 W
  • Qgd
    8.3 nC
  • QG (typ @10V)
    24 nC
  • RDS (on) (@10V) max
    11 mΩ
  • RthJC max
    1.4 K/W
  • Tj max
    150 °C
  • VDS max
    60 V
  • VGS(th)
    4 V
  • VGS max
    20 V
OPN
IRF6674TRPBF
Product Status discontinued
Infineon Package
MG-WDSON-5
Package Name DirectFET (M)
Packing Size 4800
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status discontinued
Infineon Package
MG-WDSON-5
Package Name DirectFET (M)
Packing Size 4800
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The StrongIRFET™ power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters.

Features

  • Optimized for broadest availability
  • Product qualification according to JEDEC
  • High-current rating
  • Dual-side cooling capability
  • Low package height of 0.7mm
  • Low parasitic (1-2 nH) pkg inductance
  • 100% lead-free (No RoHS exemption)

Benefits

  • Wide distribution availability
  • Industry standard qualification level
  • High current carrying capability
  • Optimum thermal performance
  • Compact form factor
  • High efficiency
  • Environmentally friendly

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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