Active and preferred
RoHS Compliant
Lead-free

IM73A135

High performance XENSIV™ MEMS microphone with ultra high dynamic range
ea.
in stock

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IM73A135
IM73A135
ea.

Product details

  • AOP
    135 dBSPL
  • Applications
    Headphones, Conference systems, Cameras, Surveillance, Content creation mics, Medical devices, Industrial applications
  • Current Consumption
    170 µA
  • Interfaces
    Analog differential
  • Package dimensions
    4.00 x 3.00 x 1.20 mm³
  • Sensitivity
    -38 dBV
  • SNR
    73 dB(A)
  • Supply Voltage
    1.52 - 3.00 V
OPN
IM73A135V01XTSA1
Product Status active and preferred
Infineon Package
Package Name N/A
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name -
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
Infineon's XENSIV™ analog MEMS microphone, IM73A135, sets a new performance benchmark with a best-in-class SNR of 73 dB and high acoustic overload point of 135 dBSPL. Sealed Dual Membrane (SDM) MEMS technology provides high IP57 ingress protection at a microphone level. The IM73A135 achieves superior audio performance, previously only achievable by ECMs while harnessing the advantages of MEMS technology.

Features

  • Ultra-low self-noise / ultra-high SNR (73 dB)
  • Selectable power modes for battery critical applications (170/70 µA)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • Ultra high dynamic range and very high acoustic overload point (AOP) of 135 dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1 dB)
  • Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz
  • Ultra-low group delay (2µs @ 1kHz)

Benefits

  • Crystal clear audio pick up of the quietest and the loudest sounds
  • High ingress protection (IP57) at a microphone level
  • Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

Documents

Design resources

Developer community

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