Active and preferred
RoHS Compliant
Lead-free

IM70A135

High performance analog XENSIV™ MEMS microphone
Data Sheet
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IM70A135
IM70A135
Data Sheet

Product details

  • AEC-Q103-003 qualified
    on demand
  • AOP
    135 dBSPL
  • Current Consumption
    170 µA
  • Green
    RoHS compliant, Halogen free
  • Interfaces
    Analog differential
  • LFRO
    37 GHz
  • Package dimensions
    3.50 x 2.65 x 0.98 mm³
  • Sensitivity
    -38 dBV
  • SNR
    70 dB(A)
  • Supply Voltage
    1.52 - 3.00 V
Recommended
OPN
IM70A135V01XTMA1
Product Status active and preferred
Infineon Package
PG-TLGA-5-5
Package Name N/A
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-TLGA-5-5
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Infineon's XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm³. This microphone is based on Infineon's new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.

Features

  • Very High 70dB(A) Signal-to-noise ratio
  • Ultra-low power modes for battery critical applications (170/70µA)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • Ultra-high acoustic overload point (AOP) of 135dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1dB)
  • Flat frequency response with a low LFRO (low frequency roll-off) of 37Hz

Benefits

  • Powerful far-field and low volume audio pick-up
  • Crystal clear audio signals even in compact package size
  • Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

Documents

Documents

Design resources

Partner solutions

Developer community

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