NEW
Active and preferred
RoHS Compliant
Lead-free

IM66D130M

NEW
Ultra-low power digital PDM XENSIV™ MEMS microphone
Data Sheet
package
board
ea.
in stock

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IM66D130M
IM66D130M
ea.
Data Sheet

Product details

  • AEC-Q103-003 qualified
    on demand
  • AOP
    130 dBSPL
  • Current Consumption
    540 µA
  • Interfaces
    Digital PDM
  • Package dimensions
    3.00 x 2.00 x 0.98 mm³
  • Sensitivity
    -37 dBFS
  • SNR
    66 dB
  • Supply Voltage
    1.6 - 3.465 V
Recommended
OPN
IM66D130MV01XTMA1
Product Status active and preferred
Infineon Package
PG-TLGA-5-8
Package Name N/A
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TLGA-5-8
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
Discover the IM66D130M – an ultra-low power digital XENSIV™ MEMS microphone, designed for applications which require long battery life, very high AOP and environmental robustness in a small package. With a Signal-to-noise ratio (SNR) of 66dB(A) and low corner frequency of 35Hz the microphone enables a clear audio experience without compromising on battery life. Enabled by a revolutionary digital microphone ASIC, the IM66D130M balances performance in a small package at a low current consumption of 540µA.

Features

  • Low current consumption in normal mode (540µA)
  • Ultra-low current consumption in low power mode (170µA)
  • Signal-to-noise ratio (SNR) of 66dB(A)
  • Acoustic overload point at 130dBSPL
  • Flat frequency response with low frequency roll-off at 35Hz
  • Component level IP57 dust and water resistant
  • Package dimensions: 3mm x 2mm x 0.98mm
  • Enhanced RF shielding
  • Digital PDM output
  • Bottom port

Benefits

  • Strong acoustic performance with small footprint and low current consumption
  • Clear audio signals even for high sound pressure levels
  • Highest precision of audio beams and algorithms

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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