not for new design
RoHS Compliant
Lead-free

IM323-L6G

CIPOS™ Tiny 600 V 15 A three-phase Intelligent Power Module
Data Sheet
ea.
in stock

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IM323-L6G
IM323-L6G
ea.
Data Sheet

Product details

  • Additional Information
    Electrical
  • Built in NTC
    Yes
  • Configuration
    3 Phase Open Emitter
  • Encryption
    no
  • IC (@ 25°)
    15 A
  • Language
    PLECS
  • Pmot (10kHz)
    1200 W
  • Product Category
    Intelligent Power Modules (IPM)
  • Product Group
    CIPOS™ Tiny
  • Product Name
    IM323-L6G
  • Qualification
    Industrial
  • Rated Current
    15 A
  • Simulator
    Yes
  • Switch Type
    IGBT
  • Voltage Class
    600 V
OPN
IM323L6GXKMA1
Product Status not for new design
Infineon Package N/A
Package Name DIP 33x19
Packing Size 240
Packing Type TUBE
Moisture Level NA
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status not for new design
Infineon Package N/A
Package Name DIP 33x19
Packing Size 240
Packing Type TUBE
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
CIPOS™ Tiny 600 V, 15 A three-phase IGBT based Intelligent Power Module in DIP 33x19 package with normal lead length (7.2mm). The Tiny IM323 product group offers the chance for integrating various power and control components to increase reliability, optimize PCB size and system costs. It is designed to control three phase AC motors and permanent magnet motors in variable speed drives for application like an air conditioning and washing machine. The package concept is specially adapted to power application, which need good thermal conduction and electrical isolation, also EMI-save control and overload protection. The reverse conducting IGBTs are combined with an optimized SOI gate driver for excellent electrical performance.

Features

  • TRENCHSTOP™ RCD2
  • C5SOI 3-phase single gate driver
  • Operating range of 1 to 20 kHz
  • Max. junct. temp. 175°C for RCD2
  • Short circuit capability min. 3µs
  • Full pack DIP 32.8x18.8 mm
  • Pin compatible solution
  • For target applications in MHA
  • Especially for RAC comp. < 1.5 hp

Diagrams

Blockdiagram_IM323-L6G
Blockdiagram_IM323-L6G
Blockdiagram_IM323-L6G Blockdiagram_IM323-L6G Blockdiagram_IM323-L6G
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