NEW
Active and preferred
RoHS Compliant
Lead-free

FS1000R08A7P3B

NEW
The HybridPACK™ Drive is a very compact six-pack module (750V/1000A) optimized for hybrid and electric vehicles.
ea.
in stock

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FS1000R08A7P3B
FS1000R08A7P3B
ea.

Product details

  • Configuration
    Sixpack
  • Features
    PinFin Base Plate
  • Housing
    HybridPACK™ Drive G2
  • IC(nom) / IF(nom)
    600 A
  • Launch year
    2025
  • Planned to be available until at least
    2035
  • Qualification
    Automotive
  • Technology
    IGBT EDT3
  • VCES (Tvj=25°C typ)
    750 V
  • Voltage Class max
    750 V
OPN
FS1000R08A7P3BHPSA1
Product Status active and preferred
Infineon Package AG-HDG2XT-7611
Package Name N/A
Packing Size 6
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free Yes
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package AG-HDG2XT-7611
Package Name -
Packing Size 6
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The power module implements Infineon’s next generation chip technology EDT3 750V, optimized for electric drive train applications, from mid- to high-range automotive power classes.

Features

  • VCES = 750 V
  • ICN = 1000 A / ICRM = 2000 A
  • Low VCE,sat
  • Low switching losses
  • Low Qg and Crss
  • Low inductive design
  • Tvj,op = 175°C
  • Integrated on-chip temperature sensor
  • Short-term temp up to 185°C
  • Direct-cooled PinFin base plate
  • PCB and cooler assembly guides
  • PressFIT contact technology

Benefits

  • Higher temperature cycling capability
  • Integrated diode temperature sensors
  • New plastic material
  • Better temperature capability
  • New frame design for lower system BOM
  • Lower AC contact resistance and tab temp
  • PressFIT Contact Technology
  • RoHS compliant
  • Completely Pb free
  • Superior reliability

Applications

Documents

Design resources

Developer community

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