Active and preferred
RoHS Compliant

FF1800XTR17T2P5

1700 V, 1800 A dual IGBT module
Data Sheet
ea.
in stock

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FF1800XTR17T2P5
FF1800XTR17T2P5
ea.
Data Sheet

Product details

  • Configuration
    half-bridge
  • Dimensions (length)
    140 mm
  • Dimensions (width)
    99.8 mm
  • Features
    .XT Technology
  • Housing
    XHP™ 2
  • IC(nom) / IF(nom)
    1800 A
  • IC max
    1800 A
  • Qualification
    Industrial
  • Technology
    IGBT5 - P5
  • VCE(sat) (Tvj=25°C typ)
    1.8 V
  • VCES / VRRM
    1700 V
  • VF
    1.75 V
  • Voltage Class max
    1700 V
Recommended
OPN
FF1800XTR17T2P5BPSA1
Product Status active and preferred
Infineon Package AG-XHP2K17
Package Name N/A
Packing Size 1
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-XHP2K17
Package Name -
Packing Size 1
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
XHP™ 2 1700 V, 1800 A dual IGBT module with .XT interconnection technology and TRENCHSTOP™ IGBT5 for high reliability and robustness, combined with system availability and long lifetime for high power traction and wind applications. Also available with preapplied Thermal Interface Material (TIM).

Features

  • Extended operation temperature (Tvjop= 175°C)
  • Output current increased by more than 25% in the same footprint
  • Copper bonds for high current carrying capabilities
  • Sintering of chips for highest power cycling capabilities
  • Total losses reduced by up to 20%
  • Package with CTI > 600

Benefits

  • Easier paralleling of modules
  • Increase in Power Density by up to 25%
  • Up to 10 times longer lifetime
  • Less cooling effort for same output power
  • Enables higher system overload conditions

Documents

Documents

Design resources

Partner solutions

Developer community

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