NEW
Active and preferred
RoHS Compliant

FF1400R23T2E7P_B5

NEW
2300 V, 1400 A dual IGBT module

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FF1400R23T2E7P_B5
FF1400R23T2E7P_B5

Product details

  • Configuration
    half-bridge
  • Dimensions (length)
    140 mm
  • Dimensions (width)
    100 mm
  • Features
    TIM, 6 kV iso
  • Housing
    XHP™ 2
  • IC(nom) / IF(nom)
    1400 A
  • IC max
    1400 A
  • Qualification
    Industrial
  • Technology
    IGBT7 - E7
  • VCE(sat) (Tvj=25°C typ)
    1.85 V
  • VCES / VRRM
    2300 V
  • VF (Tvj=25°C typ)
    3.05 V
  • Voltage Class max
    2300 V
OPN
FF1400R23T2E7PB5BPSA1
Product Status active and preferred
Infineon Package AG-XHP2K23
Package Name N/A
Packing Size 4
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package AG-XHP2K23
Package Name -
Packing Size 4
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
XHP™ 2 2300 V, 1400 A dual IGBT module in low inductive XHP™ 2 housing with Thermal Interface Material including TRENCHSTOP™ IGBT7 for high power density and providing 6 kV isolation voltage to address 3-level topologies.

Features

  • Low inductive XHP™ 2 housing
  • Extended operation temperature (Tvj max=175°C)
  • Package with CTI > 600
  • 6 kV isolation voltage
  • AlSiC baseplate

Benefits

  • Easier paralleling of modules
  • Enables higher system overload conditions
  • Energy efficiency
  • High power density

Documents

Design resources

Developer community

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